SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
07/14/2008
Revised (if Applicable):
Name of Task Force (TF):
Wafer Bond Task Force
Global Technical Committee:
MEMS / NEMS
Originating Technical Committee Region:
North America
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1. Charter:
(State the objective of the proposed TF.)
Investigate and develop standards for application of wafer-bonding for MEMS
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2. Scope:
(Define the specific activities that the TF will conduct.)
Define dimensions, tolerances, locations and other attributes of on-wafer bonding targets employed in direct-wafer and other wafer bonding applications in MEMS manufacturing. Create related bond test methods.
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
European MEMS Committee
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4. Formation Date:
(TF formed on)
Task Force formed on:
04/07/2008
Task Force approved by Committee/GCS on:
04/07/2008
5. Comments
None.
