SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
12/11/2021
Revised (if Applicable):
12/20/2021
Name of Task Force (TF):
Advanced Backend Factory Integration Task Force
Global Technical Committee:
Information & Control
Originating Technical Committee Region:
China
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1. Charter:
(State the objective of the proposed TF.)
To explore, evaluate, discuss, and develop the equipment automation standard suite for Backend tools (Bump, Chip Probing, Assembly, Final Test and Sensor) that enable and enhance full automation process of packaging (including TSV , Fan-Out and WLCSP) and testing for semiconductor manufacturing.
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2. Scope:
(Define the specific activities that the TF will conduct.)
The primary focus of the Advanced Backend Factory Integration Task Force is to support and refine the equipment automation interface standards suite. In particular the following topics will be addressed:
1. GEM 300 & HSMS Support
2. Dice operational scenario
3. Dice stacking capability and equipment automation specification
4. Traceability of multi-wafers, multi-dice operation and raw packaging materials
5. Discovery and management of data acquisition configuration
6. Discovery of the structure and organization of the equipment and its subsystems and components
7. Marking operation
8. Standardization for lot indexing on based continuous processing
9. Wafer level packaging.
11. Information included in 2D QR Code for Product Tracking.
12. E109 Reticle Tracking Support.
13. Line-based ARAMS Evaluation.
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Advanced Backend Factory Integration TF North America;
Advanced Backend Factory Integration TF Korea;
Backend Factory Integration TF Taiwan;
Backend Factory Integration TF Japan.
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4. Formation Date:
(TF formed on)
Task Force formed on:
12/20/2021
Task Force approved by Committee/GCS on:
12/20/2021
5. Comments
None.
