SEMI International Standards
Date Prepared: 04/07/2014
Revised (if Applicable):

Name of Task Force (TF): Thin Chip Handling Task Force

Global Technical Committee: 3D Packaging and Integration
Originating Technical Committee Region: Japan

1. Charter: (State the objective of the proposed TF.)
The Thin Chip Handling TF aims to develop standards for carriers such as chip trays for reliable handling and shipping of thin chips and dies used in high-volume 3D IC manufacturing.
2. Scope: (Define the specific activities that the TF will conduct.)
The TF will define requirements for carriers to handle thin chips including physical interfaces used in 3D IC manufacturing, as well as shipping requirements, including packaging, reliability, and other relevant criteria for thin chips.

2-1.The TF will develop a specification and the test methods for the carriers to meet the requirements.
2-2.The TF will develop standards to handle thin chips and die by adhesive tray and others.
2-3.The TF will define dimensions, the test method for adhesive strength of adhesive tray.

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Thin Wafer Handling TF, North America 3DS-IC Standards Committee, Taiwan 3DS-IC Committee
4. Formation Date:(TF formed on)

Task Force formed on: 03/20/2014
Task Force approved by Committee/GCS on: 03/20/2014

Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.