SEMI International Standards
Standards New Activity Report Form (SNARF)
Revised (if Applicable):
Revision of SEMI M12-0706 (reapproved 0318), Specification for Serial Alphanumeric Marking of the Front Surface of Wafers, with title change to: Specification for Alphanumeric Marking of Wafers
Originating Global Technical Committee:
Originating TC Chapter:
Task Force (TF) in which work is to be carried out:
5 Year Review Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
The new revision aims to add the option of having the alphanumeric marking not only on the front surface of the wafer, but also on the back surface of the wafer, including non-polished wafer surface. The update will provide more options available for best fit of companies in the supply chain and demonstrate actual industry practice that also applies the alphanumeric marking on the back surface of the wafer through customer specific requests. Therefore, the specification title is also revised to reflect this as “Specification for Alphanumeric Marking of Silicon Wafers”. Another key update is to remove notched 150mm wafer from the specification as there is no specification of the wafer in SEMI M1.
b. Estimate effect on industry.
3: Major effect on a few companies - identify the relevant companies
Sector or Company Information:
Silicon wafer users and suppliers for 200mm and smaller diameter wafers
c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement is anticipated
Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Addition of back surface of the wafer as an option to the alphanumeric marking character window location, as well as the removal of 150mm notched wafer. Therefore, the specification title is also revised to reflect this as “Specification for Alphanumeric Marking of Silicon Wafers”.
- Adding alphanumeric marking at back surface in addition to front surface which defined in current M12.
- Change the document title with removal of front surface as “Specification for Alphanumeric Marking of Silicon Wafers”
- Remove 150mm notched wafer because M1 doesn’t specify this wafer.
b: Expected result of activity
Major revision to an existing Standard or Safety Guideline
For a new Subordinate Standard, identify the Primary Standard here:
Modification of an existing part of Standard(s) or Safety Guideline(s) including Appendices, Complementary Files, and Supplementary Materials
For Standards, identify the Standard Subtype below:
3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start:
b. 1st Draft by:
c. (Optional) Informational Ballot by:
d. Letter Ballot by:
e. TC Chapter Approval By:
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
Silicon Wafer Committee
List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):
will be issued – identify the recipient global technical committee(s):
Identify the recipient global technical committee(s):
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline
to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the
for special procedures to be followed.
NOT to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is still technically sound and complete.
6. Intellectual Property Considerations:
For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines
the use of patented technology is NOT required.
If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:
For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)
The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required
the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’
: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of
§ 16 must be followed.
will incorporate Copyrighted Item’
: A copyright release letter must be obtained from the copyright owner prior to publication.
7. Comments, Special Circumstances:
TC Member Review:
took place between (put dates below) before approval by the GCS, or
Member Review Start Date;
Member Review End Date:
‘TC Member Review’ is required by the
for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to
9. SNARF Approval Dates:
TC Chapter or GCS
Recorded in TC Minutes
10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
Attach Pictures and Files here: