SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
09/18/2023
Revised (if Applicable):
Name of Task Force (TF):
FHE Assembly Task Force
Global Technical Committee:
Flexible Hybrid Electronics (FHE)
Originating Technical Committee Region:
North America
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1. Charter:
(State the objective of the proposed TF.)
The TF’s charter focus on detailing guidelines, benchmark testing, and initial joint/interface testing for the assembly of components/connectors onto FHE substrates with different attachment techniques, integration of FHE substrates with other FHE substrates and/or rigid boards, and assembly of FHE substrates to their final formfactor.
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2. Scope:
(Define the specific activities that the TF will conduct.)
The TF’s scope is to develop standards on assembly techniques including but not limited to conductive adhesives, anisotropic conductive adhesive (ACA), anisotropic conductive films (ACF), solders, and printed conductors. In this scope we will define the testing for determining acceptable ranges of for assembly of passives, connectors, packaged actives, bare die, etc. for the different assembly techniques in the context of application needs (electrical, mechanical, thermal). This will factor in the full stack of materials needed in the assembly including: underfills, encapsulants, and rigid modifiers to support assembly.
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Global FHE TC and all NA FHE Task Forces
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4. Formation Date:
(TF formed on)
Task Force formed on:
09/18/2023
Task Force approved by Committee/GCS on:
09/18/2023
5. Comments
None.
