SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared: 07/14/2008
Revised (if Applicable):

Name of Task Force (TF): Wafer Bond

Global Technical Committee: MEMS / NEMS
Originating Technical Committee Region: North America


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1. Charter: (State the objective of the proposed TF.)
Investigate and develop standards for application of wafer-bonding for MEMS
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2. Scope: (Define the specific activities that the TF will conduct.)
Define dimensions, tolerances, locations and other attributes of on-wafer bonding targets employed in direct-wafer and other wafer bonding applications in MEMS manufacturing. Create related bond test methods.
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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
European MEMS Committee
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4. Formation Date:(TF formed on)

Task Force formed on: 04/07/2008
Task Force approved by Committee/GCS on: 04/07/2008

5. Comments
None.