SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 10/17/2018Revised (if Applicable):

Document Number: 6473
SNARF for: New Subordinate Standard: Test Method for Measuring Surface Metal Contamination Through ICP-MS of Showerheads Used in Semiconductor Wafer Processing

Originating Global Technical Committee: Metrics
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: Critical Chamber Components (CCC) Test Methods Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)

1) Common part with Primary Standard:
Metal contamination of critical chamber components of process modules composing production equipment for semiconductor device manufacturing can have significant negative effects on wafer yield and reliabilities of the semiconductor devices.
In order for the supplier of the processing equipment to control the quality of its product (i.e., processing equipment), it is necessary to establish a reliable metal contamination measurement method applicable to various components that is in line of sight of the wafers and can transfer contaminants in the process environment during processing.

Since metal contamination control of such components becomes one of the essential quality demands by the user (i.e., device manufacturer) of the processing equipment, such measurement method and procedures need to be standardized to facilitate better communication between the supplier and the user.

2) Additional Rational for the Subordinate Standard:
Each type of critical chamber components possesses different structural features more often by its functions in the process chamber than by the model/type/supplier of processing equipment/chamber in which it is used. It was deemed efficient to address necessary considerations and handling specific to each type of critical chamber component by using the Subordinate Standard format.

Among those components that are in line of sight of the wafers in the process environment during processing, showerheads are potentially one of the most significant contributors for metal contamination of wafer and other chamber components due to its extensive exposure to plasma, heat, and aggressive chemistry including radicals.

As showerheads have numbers of through holes, which may need special consideration for metal extraction procedures due to their potential difference of surface finish/condition from the face of the plate and their dimensions (e.g., aspect ratio, rounding, and their variations), showerheads were chosen to be the subject of the pilot for the critical chamber components type specific Subordinate Standard.

b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: Semiconductor (FEP)

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:

1) Specific to this Subordinate Standard
- Additional criteria/considerations and necessary adaptations to apply the Test Method specified in the Primary Standard to the “showerhead” type of critical chamber components.
--Including but not limited to handling of the through holes, exclusion zones, and extraction method
--Recommended example of report format (can be RI)

2) Common (dependent) to the Primary Standard
- This document describes procedures for measurement of surface trace metal concentration of critical chamber components (e.g., showerheads, pedestals) by inductively coupled plasma mass spectrometry (ICP-MS).
- This document describes a common test method applicable for critical chamber components.
- This document covers local extraction and full immersion trace metal collection techniques.
- This document recommends the object metals including but not limited to; Aluminum (Al), Sodium (Na), Potassium (K), Calcium (Ca), Lithium (Li), Iron (Fe), Copper (Cu), Nickel (Ni), Chromium (Cr), Cobalt (Co), Titanium (Ti), Magnesium (Mg), and Zinc (Zn).

b: Expected result of activity
New Subordinate Standard to an existing Standard or to a new Primary Standard to be developed concurrently with this new Subordinate Standard

For a new Subordinate Standard, identify the Primary Standard here:

Document under concurrent development, which is titled as “ New Standard: Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing"

For Standards, identify the Standard Subtype below:
Test Method

Miscellaneous (describe below):

3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 11/07/2018b. 1st Draft by:
c. (Optional) Informational Ballot by: d. Letter Ballot by: 05/01/2019
e. TC Chapter Approval By:07/01/2019

4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual 7):

c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:

b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include reproduced copyrighted material

NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

7. Comments, Special Circumstances:

8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 10/19/2018
Member Review End Date: 11/5/2018

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations 8.2.1)

9. SNARF Approval Dates:
TC Chapter or GCS11/08/2018
Recorded in TC Minutes11/08/2018


10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on

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