SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 04/01/2021Revised (if Applicable):

Document Number: 6748
SNARF for: New Standard: Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads used in Semiconductor Manufacturing

Originating Global Technical Committee: Liquid Chemicals
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: Chemical Mechanical Planarization Consumables (CMP-C) Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Manufacturers of the “windowed” Chemical Mechanical Polishing (CMP) pads report diverse and non- standardized parameters to describe properties of the End Point Detection polymer windows. This diverse matrix of parameters generates difficulties in assessing and comparing performance of the “windowed” CMP pads for the end users of these pads. To meet the current semiconductor needs and address any gaps, a consistent method for reporting performance parameters is necessary. This guide (with full performance parameter matrix) will allow for the consistency of reporting across the industry when polymer windowed CMP pads are required.


b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information: IDMs/ODMs; manufacturers of CMP pads; suppliers/sub suppliers for CMP pad manufacturers.

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
• To specify set of the parameters that are important to assess performance of CMP pads, including EPD capabilities
• To provide guidance for comprehensive reporting of the parameters and test conditions for CMP “windowed” pads and polymer windows.


b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Guide

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 04/01/2021b. 1st Draft by: 12/31/2021
c. (Optional) Informational Ballot by: d. Letter Ballot by: 01/30/2022
e. TC Chapter Approval By:02/01/2022

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
None

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):
None

c. Intercommittee Ballots:
will not be issued

Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required



NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:

Passed A&R Cycle: 01-2022
Published as: SEMI C104 
Publishing Cycle: 0622 


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8. TC Member Review:
took place between (put dates below) before approval by the GCS, or

Member Review Start Date; 03/11/2021
Member Review End Date: 03/25/2021

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS04/01/2021
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
SNARF_CMP-C TF_Windows (new)_distr.pdfSNARF_CMP-C TF_Windows (new)_distr.pdfSNARF_CMP-C TF_Windows (new)_distr.docSNARF_CMP-C TF_Windows (new)_distr.doc