SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared: 08/27/2013
Revised (if Applicable):

Name of Task Force (TF): Fiducial Mark Interoperability Task Force

Global Technical Committee: Physical Interfaces & Carriers
Originating Technical Committee Region: Japan


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1. Charter: (State the objective of the proposed TF.)

Standardization of fiducial mark as the alternative to the notch is now under development at the International 450mm Wafer Task Force under the Global Silicon Wafer Committee.

Adoption of fiducial mark will affect not only Si wafer specification and related Standards but also Standards owned by other Global Technical Committees that reference the Notch. Furthermore, as readability of fiducial mark may change due to intentional and unintentional interaction of wafer surface and various tools in their process apparatuses and with wafer handling mechanisms, standardization of fiducial mark detection data and their communication is deemed necessary to support traceability and to compensate deteriorated readability of Fiducial Mark.

In order to address above cross disciplinary challenge, this Task Force is established under five Global Technical Committees, and develops the Standards to support the fiducial mark.

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2. Scope: (Define the specific activities that the TF will conduct.)

-Investigate and verify to introduce the fiducial mark.
-Develop Standards to support the fiducial mark, such as T7 revision (Traceability Committee), Wafer Handling issue (Physical Interfaces & Carriers Committee), Backend Alignment issue (Assembly & Packaging Committee), Fiducial Mark Information Handling issue (Information & Control Committee) and so on.
Development of physical specification of fiducial mark is outside the scope of this TF

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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)

Global Traceability Committee
Global Silicon Wafer Committee
International 450mm Wafer Task Force
Global Physical Interfaces & Carriers Committee
Global Assembly & Packaging Committee
Global Information & Control Committee

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4. Formation Date:(TF formed on)

Task Force formed on:
Task Force approved by Committee/GCS on: 04/01/2013

5. Comments
None.