Activity Number: 5473
SNARF for: New Standard: Guide for Alignment Mark for 3DS-IC Process
SEMI International Standards
SEMI New Activity Report Form (SNARF)
1. Rationale: To ensure consistent precise alignment of layers, chips and wafers, the photo alignment mark configuration is the key and should be developed. Therefore, the guide will provide alignment mark strategy for die to die, die to wafer, and wafer to wafer stacking. This guide will address the universal alignment mark where the outcome will be a feasible photo alignment standard.
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector
Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible
a: Define the areas to be covered or addressed by this activity or document:
Define and develop litho alignment strategy for die to die (DDL), die to wafer (DWL) and wafer to wafer (WWL) stacking. The alignment mark is preferred to be implemented at front side final metal and/or backside metal layer masking. This guide will address universal alignment mark, including shape, dimension, and location will be proposed. The outcome of a feasible photo alignment standard will be critical to the DDL, DWL and WWL stacking.
b: Expected result of activity
3. Projected Timetable for Completion:
|Originating Global Technical Committee: 3DS-IC|
|Originating Technical Committee Region: Taiwan|
|Task Force in which work is to be carried out: 3DS IC Middle End Process Task Force|
|a: General Milestones|
|a. Activity Start: 06/06/2012||b. 1st Draft by: 05/15/2013|
|c. Preballot by: 07/30/2013||d. Technical Ballot by: 09/30/2013|
|e. Committee Approval By:06/11/2013|
The resulting document is expected NOT to be a Safety Guideline
Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, there is no alternative to the use of patented technology or copyrighted item(s)
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material
Comments, Special Circumstances: None.
Approval: Activity approved by Committee/GCS on June 6, 2012
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