SEMI International Standards
SEMI New Activity Report Form (SNARF)

Activity Number: 5588
SNARF for: Line Item Revision to SEMI 3D2-0113, Specification for Glass Carrier Wafers for 3DS-IC Applications

Originating Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America
Task Force in which work is to be carried out: 3DS-IC Bonded Wafer Stacks

1. Rationale: Current standard 3D2-0113 contains an error (typo) in table 1 part 2, section 2-6.3 Scratch/dig.
Rate the Estimated Effect on the Industry
4: Slight effect or effect not determinable

Rate the Estimated Technical Difficulty of the Activity
I: No Difficulty - Proven concepts and techniques exist or quick agreement anticipated

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Line item revision of table 1, part 2, 2-6.3 Scratch/dig, the first numbers (grade A wafers) are supposed to read 20/10 and not 60/40.

b: Expected result of activity
Revision to an existing Standard/Guideline

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 04/02/2013b. 1st Draft by: 04/05/2013
c. Preballot by: d. Technical Ballot by: 05/03/2013
e. Committee Approval By:07/09/2013

Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline

Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on April 2, 2013