SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 09/11/2012Revised (if Applicable):

Document Number: 5485
SNARF for: New Standard: Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products

Originating Global Technical Committee: 3DS-IC
Originating TC Chapter: Taiwan
Task Force (TF) in which work is to be carried out: 3DS IC Testing Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
To ensure consistent yield control of 3DS-IC products, common criteria for incoming quality control (IQC) and outgoing quality control (OQC) of OSATs (outsourced sub-assembly and test providers) are needed. The generic testing flows for different 3DS-IC products to also be defined in this document will expedite the progress of 3DS-IC testing.

b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: 3DIC manufacturers, OSATs

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This guide will define the criteria of incoming quality control (IQC) and outgoing quality control (OQC) of OSATs, such as appearance, TSV void percentage by X-ray inspection, etc., to clarify the manufacturer’s responsibilities and to improve product yield. This guide will also define the generic testing flows for different 3DS-IC products, such as chip on chip (CoC), chip on substrate (CoS), stacked chip on substrate (CoS), wafer on wafer (WoW), etc., to help accelerate the progress of 3DS-IC testing.

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:

For Standards, identify the Standard Subtype below:

Miscellaneous (describe below):

3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 09/11/2012b. 1st Draft by: 03/15/2013
c. (Optional) Informational Ballot by: d. Letter Ballot by: 04/01/2013
e. TC Chapter Approval By:06/01/2013

4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
Japan Test TC

b. Intercommittee Ballots:

Identify the recipient global technical committee(s):

5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:

b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:

NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 16 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

7. Comments, Special Circumstances:

8. TC Member Review:

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
9.. SNARF Approval Dates:
TC Chapter or GCS09/11/2012
Recorded in TC Minutes
Attach Pictures and Files here: