Activity Number: 5485
SNARF for: New Standard: Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products
SEMI International Standards
SEMI New Activity Report Form (SNARF)
1. Rationale: To ensure consistent yield control of 3DS-IC products, common criteria for incoming quality control (IQC) and outgoing quality control (OQC) of OSATs (outsourced sub-assembly and test providers) are needed. The generic testing flows for different 3DS-IC products to also be defined in this document will expedite the progress of 3DS-IC testing.
|Originating Global Technical Committee: 3DS-IC|
|Originating Technical Committee Region: Taiwan|
|Task Force in which work is to be carried out: 3DS IC Testing Task Force|
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector
Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible
a: Define the areas to be covered or addressed by this activity or document:
This guide will define the criteria of incoming quality control (IQC) and outgoing quality control (OQC) of OSATs, such as appearance, TSV void percentage by X-ray inspection, etc., to clarify the manufacturer’s responsibilities and to improve product yield. This guide will also define the generic testing flows for different 3DS-IC products, such as chip on chip (CoC), chip on substrate (CoS), stacked chip on substrate (CoS), wafer on wafer (WoW), etc., to help accelerate the progress of 3DS-IC testing.
b: Expected result of activity
3. Projected Timetable for Completion:
|a: General Milestones|
|a. Activity Start: 09/11/2012||b. 1st Draft by: 03/15/2013|
|c. Preballot by: ||d. Technical Ballot by: 04/01/2013|
|e. Committee Approval By:06/01/2013|
The resulting document is expected NOT to be a Safety Guideline
Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material
Comments, Special Circumstances: None.
Approval: Activity approved by Committee/GCS on September 11, 2012
Copyright ©2014 Semiconductor Equipment and Materials International (SEMI®). All rights reserved.