SEMI International Standards
Date Prepared: 03/25/2013
Revised (if Applicable): 12/20/2013

Name of Task Force (TF): Thin Chip (Die) Bending Strength Measurement Method Task Force

Global Technical Committee: Assembly & Packaging
Originating Technical Committee Region: Japan

1. Charter: (State the objective of the proposed TF.)
Spreading out of 3D Packaging, wafer/chip thickness becomes thinner and thinner. Chip strength measurement had already been standardized, but it needs special tool for less than 50um thickness and is not convenient method. To solve this problem, we propose new bending strength measurement method called “Cantilever Bending Method” for ultra-thin dice.
It will make easy to prescribe in requirements and specifications among several suppliers and achieve smooth handling through the supply-chain.

2. Scope: (Define the specific activities that the TF will conduct.)
*Method of Chip Strength Measurement for Ultra Thin Thickness (<50um)
*Clarified by Chip Thickness

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
*3DS-IC (NA) Inspection & Metrogy TF
*3DS-IC (TW) Test TF

4. Formation Date:(TF formed on)

Task Force formed on: 03/25/2013
Task Force approved by Committee/GCS on: 03/25/2013