SEMI International Standards
Task Force Organization Form (TFOF)
Task Force Name: Thin Chip (Die) Bending Strength Measurement Method Task Force
|Global Technical Committee: Assembly & Packaging|
|Originating Technical Committee Region: Japan|
Spreading out of 3D Packaging, wafer/chip thickness becomes thinner and thinner. Chip strength measurement had already been standardized, but it needs special tool for less than 50um thickness and is not convenient method. To solve this problem, we propose new bending strength measurement method called “Cantilever Bending Method” for ultra-thin dice.
It will make easy to prescribe in requirements and specifications among several suppliers and achieve smooth handling through the supply-chain.
*Method of Chip Strength Measurement for Ultra Thin Thickness (<50um)
*Clarified by Chip Thickness
3. Formal linkages with Task Forces in other Regions:
*3DS-IC (NA) Inspection & Metrogy TF
*3DS-IC (TW) Test TF
Task Force formed on: 03/25/2013
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