SEMI International Standards TASK FORCE ORGANIZATION FORM (TFOF)

Date Prepared: 01/10/1996

Revised (if Applicable): 07/14/2004

Name of Task Force (TF): ESD/ESC Task Force- N.A

Global Technical Committee: Metrics

Originating Technical Committee Region: North America

_____________________________________________________________________________
1. Charter: (State the objective of the proposed TF.)
The mission is to minimize the impact on capital productivity due to the presence of static charge in semiconductor manufacturing environments. The first objective of this activity is to create a matrix of acceptable levels of static charge at the input and exit ports of production equipment for the purposes of:
a. Eliminating equipment lock-up problems due to ESD events that produce electromagnetic interference.
b. Reducing the attraction of particles to charged surfaces.
c. Reducing product and reticle damage due to ESD.
The second objective is to review and update the SEMI E43-95 document which describes methods of making static charge measurements.
The third objective is to extend the matrix of acceptable static charge levels to the entire semiconductor manufacturing environment.
_____________________________________________________________________________
2. Scope: (Define the specific activities that the TF will conduct.)
The scope of the first document is limited to setting a standard for the acceptable level of static charge on product, product carriers, and parts of the input/exit ports of process equipment. A future document will address the need for static control in the entire semiconductor manufacturing environment.

It is known that handling any object is likely to change the level of static charge measured on its surface. Many semiconductor manufacturing processes also generate undesirable levels of static charge. Protecting the product or carrier from static charge generation at other points of the process, such as the interior of process tools will need to be left to the ingenuity of users and equipment manufacturers. It is proposed that the Appendix of this document contain case histories from users and equipment manufacturers as to the static charge problems encountered and how they were solved. A bibliography of related technical papers can also be included.

The existing E43-95 document describes procedures for measuring static charge using an electrostatic fieldmeter. The review and update of this document will add a number of other static charge measurement methods.

_____________________________________________________________________________
3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
ESD/ESC Task Force -Japan
Japan - Metrics Committee
Europe - Equipment Automation Committee
IEC - Technical Committees 47 and 101 on Electrostatics.
ESD Association - Ron Gibson (Celestica, Toronto, Canada) or John Kinnear (IBM, Poughkeepsie NY)
Reliability Center of Japan (RCJ)
_____________________________________________________________________________
4. Formation Date:(TF formed on)

Task Force formed on: 07/15/1996
Task Force approved by Committee/GCS on:

5. Comments
None.