SEMI International Standards
Task Force Organization Form (TFOF)


Task Force Name: 3DS-IC Bonded Wafer Stacks


Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America


1. Charter:

The BWS Task Force will actively create and/or modify specifications that reflect bonded wafer stacks parameters and the wafer bonding process.

2. Scope:
* Identify new wafer parameters that reflect adequate ranges for bonded wafer stacks
* Modify/create document to reflect adequate ranges for bonded wafer stacks
* Identify other SEMI standards that are adversely affected by BWS parameters
* Update referenced standards: create/modify standards to reflect BWS parameters


3. Formal linkages with Task Forces in other Regions:
Global 3DS-IC Committee
Global Silicon Committee
Global MEMS Committee
Will liaise with appropriate regional committees as they are formed


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4. Approval:
Task Force formed on: 01/25/2011