SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 10/24/2023Revised (if Applicable):

Document Number: 7196
SNARF for: Revision to SEMI F47-0706 (Reapproved 0812), Specification for Semiconductor Processing Equipment Voltage Sag Immunity

Originating Global Technical Committee: Facilities
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: Voltage Sag Immunity Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
The SEMI Voltage Sag Immunity Task Force efforts to revise SEMI F47 was approved in was originally efforts were approved by a SNARF in 2018. The work diligently began in early 2019 and has continued into 2022. Due to delays in specific testing and analysis of semiconductor tools and equipment to test during the COVID pandemic, the TF work is expected to go into 2024.

SEMI F47 requires voltage sag immunity levels for single-phase and two-phase voltage sag events. Since the implementation of SEMI F47, the vulnerability of semiconductor manufacturing to voltage sags has improved significantly. However, semiconductor manufacturers have realized that they continue to experience significant product loss and downtime due to minor three-phase voltage sag events. Although three-phase voltage sag testing is not currently included in the SEMI F47 standard, these events can account for as many as 20 percent of the events according to recent studies. If semiconductor processing equipment can be made more robust to three-phase voltage sags, semiconductor plants losses due to power quality problems may be significantly reduced. A modification to the current SEMI F47 standard is required to allow for three-phase voltage sag characterization.


b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information: Wafer processing, flat panel

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Task 1: Review Existing SEMI F47-0706 Requirements with respect to three-phase voltage sags.
(Completed)

Task 2: Baseline Voltage Sags Causing Downtime at Semiconductor Fabs. Since the inception of SEMI F47, many equipment providers have hardened their designs to make the tools more robust to Type I and Type II voltage sag events per SEMI F47. However, semiconductor fabs are noting that some tool sets are not able to survive minor three-phase voltage sags. The objective of this task is to work with tool suppliers, semiconductor fabs and the electric utilities to base-line the power quality events that are causing the continued downtime. The more granular this data collection effort, the better the outcome of the analysis. (Completed)

Task 3: Baseline Sag Immunity of Select Tools. This task will begin with reviewing existing tool specification with respect to three-phase voltage range tolerance and other determined power quality and equipment susceptibility issues that are still causing downtime for semiconductor tools. Working with the tool manufacturers, it is expected that a subset of tools will be characterized against Type I, II, and III voltage sags in either the tool manufacturer locations or within semiconductor fabs themselves. The proposed Type III voltage sag immunity target from Task 2 will be evaluated as well. The outcome of this work will provide critical information with respect to the voltage sag robustness of the tool sets with respect to Type I, II, and III voltage sags and define gaps between the actual immunity level and the proposed target. When possible, mitigation strategies may be tested simultaneously against the defined voltage sag immunity targets. The task force report out for this effort will be presented generically with respect to tool specifics (make/model information) to protect confidentiality. (Nearing Completion)

Task 4: Determine Viable Mitigation Strategies. Based on results from Task 3, viable voltage sag mitigation strategies will be explored for hardening equipment to meet the voltage sag immunity target for Type III events and other determined power quality and equipment susceptibility issues. Viable solutions will be explored at component, tool, facility, and utility levels and will evaluate both technical and economic considerations at each level. Where possible, this task will demonstrate via case studies from existing applications or new testing the effective mitigation strategies to provide the targeted immunity including Type III voltage sag events. The task force report out for this effort will be presented generically with respect to tool specifics (make/model information) to protect confidentiality. (Ongoing)

Task 5: Communicate Findings of Task Force. Technical transfer of the general findings from the
task force effort will be presented in technical papers, periodic webcasts, and workshops per the direction of the task force. This effort will happen in congruence with the other task force activities. (Ongoing)

Task 6: Provide Recommendations to update SEMI F47 standard accordingly to reflect findings of the Task Force. Based on the learnings form the task force efforts, recommendations will be made for any required modifications to SEMI F47-0706 or related guidelines SEMI F49-02003 and SEMI F50-02004. (Starting Task) – Completion targeted by end of 1Q 2024.

b: Expected result of activity
Major revision to an existing Standard or Safety Guideline

For a new Subordinate Standard, identify the Primary Standard here:


Modification of an existing part of Standard(s) or Safety Guideline(s) including Appendices, Complementary Files, and Supplementary Materials, Addition of one or more Related Information sections or Various Materials to an existing Standard or Safety Guideline

For Standards, identify the Standard Subtype below:
Specification

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 07/01/2023b. 1st Draft by: 12/20/2023
c. (Optional) Informational Ballot by: d. Letter Ballot by: 02/01/2024
e. TC Chapter Approval By:03/26/2024

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
EH&S
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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
This is a continuation of the effort that began in 2018.

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8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 10/24/2023
Member Review End Date: 11/06/2023

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS11/07/2023
Recorded in TC Minutes11/07/2023

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on