SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
01/12/2011
Revised (if Applicable):
Name of Task Force (TF):
3DS-IC Inspection and Metrology
Global Technical Committee:
3DS-IC
Originating Technical Committee Region:
North America
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1. Charter:
(State the objective of the proposed TF.)
Develop standards for metrology and inspection methods to be used in measuring the properties of TSV’s, bonded wafer stacks, and dies used in the 3DS-IC manufacturing process.
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2. Scope:
(Define the specific activities that the TF will conduct.)
Examples of needed standards include (but are not limited to):
* TSV physical properties i.e. depth, top, bottom CD, side wall….
* Bonded wafer stack properties i.e. overlay, bond inspection
* Defect metrology
* Dies ???
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Currently none but will liaise with appropriate regional committees as they are formed
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4. Formation Date:
(TF formed on)
Task Force formed on:
01/25/2011
Task Force approved by Committee/GCS on:
01/25/2011
5. Comments
None.
