SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 01/25/2022Revised (if Applicable):

Document Number: 6921
SNARF for: New Standard:Guide for Adding Maximum Allowable Current (MAC) Information for Wafer Testing Probe

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: Taiwan
Task Force (TF) in which work is to be carried out: 3DP&I Testing Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

___________________________________________________________________________
1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)

In view of the increasing number and complexity of 3DIC stacked chips, multiple chips such as stacked cubes and chiplets are derived and integrated in a single packaging or on the circuit board. During probing test, it is observed that the instantaneous surge current occurs in some cases, such as high current caused by short circuit, or the accumulated total current by the multi-stage circuit (3DIC stacked chips), …, etc., will exceed the capable or acceptable current limit and damage the probe.
The ISMI Current Carry Capability (CCC) standard is usually utilized to verify the probe property for probe card manufacturers, but the problem of needle burning still often occurs when operating at a current lower than CCC specification. Therefore, a new guideline needs to be formulated to provide for user reference.



b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information: IC design house, OSAT, Probe card supplier

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

___________________________________________________________________________
2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This work will formulate a guideline for reference, when users want to test more complex stacked wafers. That is: in addition to providing CCC (current carrying capability) test data for probe or probe card products, the maximum allowable current (MAC) specification and its related test parameters are also disclosed.

It can help the designers and user to consider this MAC in advance when designing circuits, writing test programs and selecting probes. Generally speaking, the MAC value is lower than the CCC. Operating under the MAC specification can effectively avoid the damage of probe needle while testing complex stacked chip packaging or the high current which is generated by unexpected circuit problems, thereby increasing the test efficiency and the life of the probe.
The test method of MAC may depend on the manufacturer and product, and will not include within the scope of this guideline. More definition of the CCC and MAC can be found in the website: https://www.deringerney.com/publications/high-performance-materials-for-semiconductor-test-probes_pg3/.


b: Expected result of activity
New Subordinate Standard to an existing Standard or to a new Primary Standard to be developed concurrently with this new Subordinate Standard

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Guide

Miscellaneous (describe below):

___________________________________________________________________________
3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 02/01/2022b. 1st Draft by: 06/01/2022
c. (Optional) Informational Ballot by: d. Letter Ballot by: 10/01/2022
e. TC Chapter Approval By:03/04/2022

_____________________________________________________________________________
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
Japan, North America

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will not be issued

Identify the recipient global technical committee(s):

___________________________________________________________________________
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

___________________________________________________________________________
6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:


If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:



NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

___________________________________________________________________________
7. Comments, Special Circumstances:
None.

__________________________________________________________________________
8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 02/16/2022
Member Review End Date: 03/02/2022.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
__________________________________________________________________________

9. SNARF Approval Dates:
TC Chapter or GCS03/04/2022
Recorded in TC Minutes03/04/2022

__________________________________________________________________________

10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on