SEMI International Standards
Date Prepared: 03/19/2018
Revised (if Applicable):

Name of Task Force (TF): SMT TF

Global Technical Committee: Automation Technology
Originating Technical Committee Region: Japan

1. Charter: (State the objective of the proposed TF.)
Normally, assembly lines for PCB (Printed Circuit Board) with SMT (Surface Mount Technology) are flow-shop type and consist of various equipment (such as solder paste printer, solder inspection, parts mounter, solder reflow, and overall inspection) from various suppliers. As a lot of interfacing efforts are required to construct a production line with various equipment from various suppliers, development of standardized M2M (Machine to Machine) interface to hookup those equipment is expected.

The objective of this TF is to study and develop standardized M2M interfaces which support smarter hookup and control among equipment from various suppliers in SMT PCB assembly line.

2. Scope: (Define the specific activities that the TF will conduct.)
Study, develop, and maintain specifications which are required to hookup equipment including the following area:
・Horizontal Communication for SMT between adjacent equipment which uses SEMI A1 HC
・Vertical Communication for SMT between the host and equipment which uses Data Handshake part of SEMI A1 HC

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
4. Formation Date:(TF formed on)

Task Force formed on: 04/20/2018
Task Force approved by Committee/GCS on: