SEMI International Standards
Date Prepared: 04/02/2004
Revised (if Applicable):

Name of Task Force (TF): Japan AWG Task Force

Global Technical Committee: Silicon Wafer
Originating Technical Committee Region: Japan

1. Charter: (State the objective of the proposed TF.)
The task force is objecting to work on the topics on the International Advanced Wafer Geometry Task Force in Japan in Japanese. I-AWG TF is an international task force, and is operated in English. Many of the wafer manufacturers are in Japan and they are potential member of I-AWG TF. However some of them are finding the difficulty to actively work in the English based task force. So this task force will help those important potential members to share the I-AWG TF information and expects further contribution to the industry.
It works as a take over of the Edge task force.

2. Scope: (Define the specific activities that the TF will conduct.)
Work on the standardization on future wafer geometry related issues.
The initial topics will be 党Edge roll-off媒 and 党New Nanotopography媒.

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Parent Committee: Japan Silicon wafer committee
Related Task Force: International AWG TF

(JA Edge TF has merged to JA AWG Task Force on April 2, 2004.)

4. Formation Date:(TF formed on)

Task Force formed on: 04/02/2004
Task Force approved by Committee/GCS on: 04/02/2004