SEMI International Standards
Standards New Activity Report Form (SNARF)
Revised (if Applicable):
New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process
Originating Global Technical Committee:
3D Packaging and Integration
Originating TC Chapter:
Task Force (TF) in which work is to be carried out:
3DP&I Middle-End Process Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
3DS-IC wafer edge trimming process is a key step for successful wafer thinning after the wafer bonded in the 3DS-IC process. Therefore, the guide will provide a feasible approach to perform the wafer edge trimming. This guide will address the specs of edge trimming and resultant particle residue to ensure the successful wafer thinning process after the wafer edge trimming.
b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information:
c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible
Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Define specs for wafer edge trimming and resultant particle residue to provide a feasible approach in edge trimming process. The trimming width, depth, and resultant particle size and count will be addressed in this guide. The outcome of this applicable wafer edge trimming approach will be helpful to the subsequent wafer thinning process in the 3DS-IC process.
b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)
For a new Subordinate Standard, identify the Primary Standard here:
For Standards, identify the Standard Subtype below:
3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start:
b. 1st Draft by:
c. (Optional) Informational Ballot by:
d. Letter Ballot by:
e. TC Chapter Approval By:
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
NA 3DS-IC Committee
List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):
Identify the recipient global technical committee(s):
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline
to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the
for special procedures to be followed.
NOT to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is still technically sound and complete.
6. Intellectual Property Considerations:
For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines
If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:
For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’
: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of
§ 16 must be followed.
will incorporate Copyrighted Item’
: A copyright release letter must be obtained from the copyright owner prior to publication.
7. Comments, Special Circumstances:
TC Member Review:
Member Review Start Date;
Member Review End Date:
‘TC Member Review’ is required by the
for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to
9. SNARF Approval Dates:
TC Chapter or GCS
Recorded in TC Minutes
10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
Attach Pictures and Files here:
SNARF_Guide for Wafer Edge Trimming for 3DS-IC Process (rev).pdf