SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 07/01/2011Revised (if Applicable):

Document Number: 5270
SNARF for: New Standard: Guide for Measuring Voids in Bonded Wafer Stacks

Originating Global Technical Committee: 3DS-IC
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: 3DS-IC Inspection and Metrology
Note: If a new task force is needed, also submit a task force organization form (TFOF)

1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
This Guide will assist the user in selection and use of bond-void metrology tools based on their application and a protocol for performing bond-void measurements. New bonding processes and applications are sensitive to significantly smaller voids than bonding processes currently used for 3DS-IC package sealing. The Guide will compare detection, in bonded wafer pairs, of prefabricated voids in several oxide thicknesses, the void detection limits of a range of metrology tools and provide application recommendations. This activity will be executed in a planned 3DS-IC project at SEMATECH. The test results and analysis will create a fundamental study of oxide-bonded wafer pairs. Subsequently this study can assist producers and users of other wafer bonding processes to develop robust products and evaluations.

b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: MEMS/NEMS; 3D Stacked Integrated Circuits

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
A number of technologies have been released to measure voids between bonded wafers. These technologies each have unique strengths and weaknesses. In this activity, we will compare the capabilities of these technologies and prepare a guide to the use and applicability of these tools for different bonding applications.

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:

For Standards, identify the Standard Subtype below:

Miscellaneous (describe below):

3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 07/01/2011b. 1st Draft by: 09/15/2011
c. (Optional) Informational Ballot by: d. Letter Ballot by: 01/15/2012
e. TC Chapter Approval By:03/01/2012

4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
Silicon Wafer Committee
Metrics Committee

b. Intercommittee Ballots:

Identify the recipient global technical committee(s):

5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:

b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:

NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 16 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

7. Comments, Special Circumstances:

8. TC Member Review:

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
9.. SNARF Approval Dates:
TC Chapter or GCS07/12/2011
Recorded in TC Minutes07/12/2011
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