SEMI International Standards
Standards New Activity Report Form (SNARF)
Revised (if Applicable):
New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scatter Tomography Technique
Originating Global Technical Committee:
Originating TC Chapter:
Task Force (TF) in which work is to be carried out:
International Test Methods Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
JEITA standard documents on test method for silicon wafer are facing difficulties to be maintained due to the dissolution of corresponding JEITA committee. Those JEITA standards have been referred to by some of SEMI Standard documents. Therefore, important descriptions (or documents) in JEITA documents are required to be transferred to the corresponding SEMI Standards. The purpose of this activity is to transit effective descriptions from JEITA document as EM-3508 to SEMI Standard document, regarding “TEST METHOD FOR BULK MICRO DEFECT DENSITY AND DENUDED ZONE WIDTH IN ANNEALED SILICON WAFERS”. In conformity to a discussion at Test Method Task Force by e-mail, Japan TF decided divded into two documents which are "etching method"and "laser scattering method".
This document will be descirbed about "laser scattering method".
This standard provides covers definitions of measurement methods for bulk micro defect (BMD) densities and denuded zone (DZ) widths in annealed silicon wafers. This standard describes both preferential etching methods (JIS H 0609) and Light-scatter tomography techniques as procedures to measure BMD densities and DZ widths. These procedures have been standardized based on questionnaires and the results of inter-laboratory test measurements at ten worldwide sites conducted between January and December 2004.
b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information:
c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement is anticipated
Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This standard defines measurement techniques of BMD density and DZ width that form in silicon wafers after annealing the wafers with heat treatment. The techniques covered in this standard are intended to measure BMD density over a range of 107/cm3 to 1010/cm3 and DZ width up to 150 mm.
b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)
For a new Subordinate Standard, identify the Primary Standard here:
For Standards, identify the Standard Subtype below:
3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start:
b. 1st Draft by:
c. (Optional) Informational Ballot by:
d. Letter Ballot by:
e. TC Chapter Approval By:
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):
will be issued – identify the recipient global technical committee(s):
Identify the recipient global technical committee(s):
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline
to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the
for special procedures to be followed.
NOT to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is still technically sound and complete.
6. Intellectual Property Considerations:
For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines
the use of patented technology is NOT required.
If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:
For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required
the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’
: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of
§ 16 must be followed.
will incorporate Copyrighted Item’
: A copyright release letter must be obtained from the copyright owner prior to publication.
7. Comments, Special Circumstances:
TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or
Member Review Start Date;
Member Review End Date:
‘TC Member Review’ is required by the
for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to
9. SNARF Approval Dates:
TC Chapter or GCS
Recorded in TC Minutes
10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
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