SEMI International Standards
SEMI New Activity Report Form (SNARF)

Activity Number: 5447
SNARF for: New Standard: Terminology for Measured Geometrical Parameters of Through-Glass Vias (TGVs) in 3DS-IC Structures

Originating Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America
Task Force in which work is to be carried out: 3DS-IC Inspection and Metrology

1. Rationale: Current standards or work in progress focuses on use of silicon as a substrate or wafer. This new document should address parameters and definitions for glass as a substrate or wafer for 2.5 and 3DS-IC applications. It will follow the new standard: Terminology for Through Silicon Via Geometrical Metrology definitions where applicable and will indicate when there are differences and why.
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector

Rate the Estimated Technical Difficulty of the Activity
I: No Difficulty - Proven concepts and techniques exist or quick agreement anticipated

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Define terms currently used to describe TGV parameters which are not defined in current SEMI Standards, and list those that are already defined in current SEMI Standards. For each parameter (or group of parameters), the various technologies that are used will be listed, along with any limitations and/or issues and needs particular to that technology and to making valid comparisons to the others. Include applicable ranges for valid measurements where possible.

b: Expected result of activity
New Standard

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 07/10/2012b. 1st Draft by: 10/15/2012
c. Preballot by: d. Technical Ballot by: 01/01/2013
e. Committee Approval By:03/01/2013

Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline

Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on July 10, 2012