SEMI International Standards TASK FORCE ORGANIZATION FORM (TFOF)

Date Prepared: 04/07/2014

Revised (if Applicable): 02/05/2018

Name of Task Force (TF): 3D Packaging & Integration 5 Year Review Task Force

Global Technical Committee: 3D Packaging and Integration

Originating Technical Committee Region: Japan

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1. Charter: (State the objective of the proposed TF.)
The TF reviews the SEMI published standard documents under the 3D Packaging and Integration Technical Committee, which require 5 years reviews per SEMI requirement. Beginning of every year, the review required documents are reviewed to categorize the revision, update or inactive.
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2. Scope: (Define the specific activities that the TF will conduct.)
Every year, the standard documents are listed up for required 5 years reviews. The taskforce team will lead the documents reviews, together with the experts who are recruited for the specific standard documents contents.
1. List up the review required standard documents issued by old Assembly and Packaging TC, working together with SEMI Japan staff.
2. The TF reviews the documents per the basic concept for the document updates.
3. The TF leaders and/or members are enforced or changed when additional expertize are needed for the reviews.
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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
None.
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4. Formation Date:(TF formed on)

Task Force formed on: 03/20/2014
Task Force approved by Committee/GCS on: 03/20/2014

5. Comments
Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.