SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
09/09/2019
Revised (if Applicable):
Name of Task Force (TF):
3DS IC Bonded Layer Inspection Metrology TF
Global Technical Committee:
3D Packaging and Integration
Originating Technical Committee Region:
Japan
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1. Charter:
(State the objective of the proposed TF.)
This Task Force will focus on the reference sample specification for multi stacked wafers/dies more than two.
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2. Scope:
(Define the specific activities that the TF will conduct.)
This Task Force will develop a standard focusing on quality of joint boundary between wafers/dies such as void inspection metrology by providing a specification for a reference sample with the following areas to be addressed:
Determine the specification for separating the stacked layers of more than two wafers by standardized 3D wafer structure.
Determine the identification marks and size.
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
PLP Panel Task Force
North America 3DP&I Inspection & Metrology Task Force
North America 3DP&I Bonded Wafer Stacks Task Force
Taiwan Middle End Process Task Force
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4. Formation Date:
(TF formed on)
Task Force formed on:
11/18/2019
Task Force approved by Committee/GCS on:
10/11/2019
5. Comments
None.
