SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 07/11/2013Revised (if Applicable): 04/01/2014

Document Number: 5604
SNARF for: Line Item Revision to SEMI M1-0114, Specification for Polished Single Crystal Silicon Wafer and SEMI M20-0110, Practice for Establishing a Wafer Coordinate System (Re: Addition of Notchless 450 mm Wafers)

Originating Global Technical Committee: Silicon Wafer
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: International 450 mm Wafer Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Eliminating the wafer notch requires its replacement by a fiducial mark scribed on the back of the wafer. The proposed change will improve the wafer symmetry, increase the surface utilization. The major task is to get consensus on the mark design and positions, considering readability and potential impact on wafer integrity through the entire IC manufacturing process

b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information: silicon wafers manufacturing, wafer identification and alignment.

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Add a new category for 450 mm notchless wafer to to SEMI M1 together with the necessary text and figures in Tables 1, 9, and R1-1, and 2.2, and, Note 4, through, and Figures 6 through 9. Because the M1 revision to add the notchless wafer includes considerable reference to the angular coordinate system of SEMI M20, it is necessary to slightly revise that standard by adding reference to orientation fiducial marks in the captions to Figures 1 and 2. In addition, it was found that the equation was omitted from 7.1.9 when the current edition was published by SEMI in 2010, so this needs to be corrected.

b: Expected result of activity
Line-item revision to two or more existing Standards or Safety Guidelines

For a new Subordinate Standard, identify the Primary Standard here:

For Standards, identify the Standard Subtype below:

Miscellaneous (describe below):

3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 07/01/2013b. 1st Draft by: 12/01/2013
c. (Optional) Informational Ballot by: d. Letter Ballot by: 04/30/2014
e. TC Chapter Approval By:07/08/2014

4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
Traceability committee and PIC committee
Fiducial mark design may require update of T7, T10 and E118?

b. Intercommittee Ballots:

Identify the recipient global technical committee(s):

5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:

b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:

NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

7. Comments, Special Circumstances:
In reviewing the SNARF, John Valley (Sun Edison) informed the committee that there is a published patent “Production of Notchless Wafer (publication number US5993292 A)”. It was informed to the committee.

According to Mike Goldstein (Intel), there are number of ways of producing notchless wafer. The referenced patent is one of the methods, not THE only method of producing notchless wafer.

Pinyen Lin (G450C), the main driver for the 450 mm notches wafer standard, is aware of the patent.

In moving forward, it is the best to the knowledge of the NA Silicon Wafer committee, the use of patented technology or a copyrighted item(s) is NOT required for the activity in question. Also, it was assumed that the activity being proposed by G450C will not be required the use of patented technology.

8. TC Member Review:

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
9.. SNARF Approval Dates:
TC Chapter or GCS04/01/2014
Recorded in TC Minutes
Attach Pictures and Files here: