SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
06/23/2011
Revised (if Applicable):
Name of Task Force (TF):
MEMS Packaging Task Force
Global Technical Committee:
MEMS / NEMS
Originating Technical Committee Region:
North America
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1. Charter:
(State the objective of the proposed TF.)
Determine properties of MEMS Packaging for which standardization will improve manufacturability, reliability and design quality.
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2. Scope:
(Define the specific activities that the TF will conduct.)
Determine appropriate metrics for dimensions, physical, chemical, electrical and interface properties, and other packaging properties of MEMS devices as required.
Develop standards as appropriate.
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
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4. Formation Date:
(TF formed on)
Task Force formed on:
07/11/2011
Task Force approved by Committee/GCS on:
07/11/2011
5. Comments
MEMS Packaging Working Group was formally elevated to a task force on July 11 in conjunction with SEMICON West 2011. The MEMS Packaging Working Group was initially chartered in November 2003.
