SEMI International Standards
Date Prepared: 01/12/2011
Revised (if Applicable):

Name of Task Force (TF): 3DP&I Inspection and Metrology Task Force

Global Technical Committee: 3D Packaging and Integration
Originating Technical Committee Region: North America

1. Charter: (State the objective of the proposed TF.)
Develop standards for metrology and inspection methods to be used in measuring the properties of TSV’s, bonded wafer stacks, and dies used in the 3DS-IC manufacturing process.
2. Scope: (Define the specific activities that the TF will conduct.)
Examples of needed standards include (but are not limited to):
* TSV physical properties i.e. depth, top, bottom CD, side wall….
* Bonded wafer stack properties i.e. overlay, bond inspection
* Defect metrology
* Dies ???

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Currently none but will liaise with appropriate regional committees as they are formed
4. Formation Date:(TF formed on)

Task Force formed on: 01/25/2011
Task Force approved by Committee/GCS on: 01/25/2011

Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.