Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes


Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration


Meeting Information
Meeting Date: 06/21/2023Meeting End Date: 06/21/2023
Meeting Event: Japan Summer MeetingsMeeting Location: SEMI Japan Office - Tokyo_Japan


Minutes Information
Author: Mami Nakajo
Minutes Written In English?: Yes

English Minutes:20230621_3DPI-Japan_MeetingMinutes_approved.pdf20230621_3DPI-Japan_MeetingMinutes_approved.pdf
Attachments:Attachment_20230621_JA_3DPI.zipAttachment_20230621_JA_3DPI.zip