Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes


Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration


Meeting Information
Meeting Date: 09/05/2023Meeting End Date: 09/05/2023
Meeting Event: Japan Autumn MeetingsMeeting Location: SEMI Japan Office - Tokyo_Japan


Minutes Information
Author: Mami Nakajo
Minutes Written In English?: Yes

English Minutes:20230905_3DPI-Japan_MeetingMinutes_final.pdf20230905_3DPI-Japan_MeetingMinutes_final.pdf
Attachments:Attachments_JA_IC_20230913.zipAttachments_JA_IC_20230913.zip