Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes


Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration


Meeting Information
Meeting Date: 05/23/2024Meeting End Date: 05/23/2024
Meeting Event: Japan Spring MeetingsMeeting Location: SEMI Japan/ OVTCCM


Minutes Information
Author: Akiko Yoshida
Minutes Written In English?: Yes

English Minutes:3DP&I_JA_Minutes_20240523_R0.pdf3DP&I_JA_Minutes_20240523_R0.pdf
Attachments:Attachment.zipAttachment.zip