SEMI International Standards
Standards Locale: North America
Committee: 3D Packaging and Integration
Place of Meeting: OVTCCM
Date of Meeting: 02/12/2026
Meeting End Date: 02/12/2026
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 02/20/2026
Leadership Changes
WG/TF/SC/TC Name | Previous Leader(s) | New Leader(s) |
| 3D Packaging & Integration North America Technical Committee |  | John Ciraldo (WD Advanced Material) [New]
Chris Moore (Consultant)
Bill Kerr (Evergreen Enhancement) |
TC Chapter Structure Changes
None.
Ballot Results
Document # | Document Title | TC Chapter Action | A&R Forms for Approved Ballots |
| 7331 | New Standard: Guide for Peel Testing of RDLs and Other Traces Used Within Advanced Packages and Structures | Passed, as balloted. |  7331_ProceduralReview.pdf |
#1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
#2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next SEMI Standards NA Meetings are tentatively scheduled for the week of May 11-14, 2026, to be held in-person and virtual in conjunction with ASMC in Albany, New York. Schedule details TBD. https://www.semi.org/en/products-services/standards.
Tentative Schedule:
Thursday, May 14 (Eastern)
o Joint TFs meeting 11:00-12:00 Noon
o TC Chapter 13:00-14:30
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