SEMI International Standards TASK FORCE ORGANIZATION FORM (TFOF)

Date Prepared: 12/18/2025

Revised (if Applicable):

Name of Task Force (TF): SiC Material and Wafer TF

Global Technical Committee: Compound Semiconductor Materials

Originating Technical Committee Region: Japan

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1. Charter: (State the objective of the proposed TF.)
The TF addresses specifications and test methods of SiC wafers including homoepitaxial wafers and engineered substrates.
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2. Scope: (Define the specific activities that the TF will conduct.)
The TF will develop and maintain SEMI Standards relating to and directly concerning SiC wafers including homoepitaxial wafers and engineered substrates. These include, but are not limited to:
- specific standards addressing the geometrical and mechanical parameters, e.g., diameter, thickness, edge contour, etc.
- test methods including test equipment, evaluation methods, etc.
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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
All the TFs related to SiC in other regions and locales.
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4. Formation Date:(TF formed on)

Task Force formed on:
Task Force approved by Committee/GCS on: 12/18/2025

5. Comments
None.