SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 06/10/2025Revised (if Applicable):

Document Number: 7398
SNARF for: New Standard: Test method for Wafer Bond Strength Measurement by Double-Cantilever Beam

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: Japan
Task Force (TF) in which work is to be carried out: Wafer Bond Strength Measurement by Double-cantilever Beam Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

___________________________________________________________________________
1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
The assessment of bond strength in blanket wafer-to-wafer (W2W) bonding, particularly in the context of
direct bonding, presents several unresolved technical challenges. Although the double cantilever beam
(DCB) method is widely recognized as a standard approach, the lack of uniformity in measurement
conditions continues to undermine the reliability and reproducibility of the results. Specifically, variations
in the ambient atmosphere during testing, blade properties (including material composition, thickness, and
tip geometry) the velocity and orientation of applied mechanical force, the precision of wafer alignment,
and the surface cleanliness prior to bonding all contribute to inconsistencies in data interpretation.
Given the increasing complexity of 3D integration technologies, the establishment of a robust and
standardized evaluation framework is imperative to ensure the mechanical integrity of multi-layered
structures throughout subsequent fabrication processes.


b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information: Manufacturer for W2W bonding process and Equipment vendor

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

___________________________________________________________________________
2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
The standards for Test Method for Wafer Bond Strength Measurement by Double-Cantilever Beam will be defined as follows. This standard applies to 300 mm bonded wafers.
(1) Measuring system (Wafer setting, Wafer holding System, Blade insertion configuration, Monitoring System for delamination length, etc.)
(2) Test method (blade specification, measurement environment, insertion speed and length, measurement position, etc.)
(3) Data Analysis and Calculation Method (Formula G with the measurement results)

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Test Method

Miscellaneous (describe below):

___________________________________________________________________________
3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 06/01/2025b. 1st Draft by: 11/30/2025
c. (Optional) Informational Ballot by: d. Letter Ballot by: 12/16/2025
e. TC Chapter Approval By:05/30/2026

_____________________________________________________________________________
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
3DP&I North America and Taiwan TC Chapters

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):
N?A

c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
Silicon Wafer
___________________________________________________________________________
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

___________________________________________________________________________
6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

___________________________________________________________________________
7. Comments, Special Circumstances:
None.

__________________________________________________________________________
8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 09/03/2025
Member Review End Date: 09/16/2025

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
__________________________________________________________________________

9. SNARF Approval Dates:
TC Chapter or GCS10/06/2025
Recorded in TC Minutes

__________________________________________________________________________

10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on