SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 11/01/2024Revised (if Applicable):

Document Number: 7357
SNARF for: New Standard: Specification for Failure Analysis Reporting

Originating Global Technical Committee: Information & Control
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: Process Control System NA
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
As part of the semiconductor manufacturing process and value chain, substrates (such as wafers or
finished products) are analyzed for failure.
The Failure Analysis process is characterized by a series of analysis steps resulting in images. Images can be captured by visual means of a camera as well as synthesized representations of measurement data that look like a picture or photo.
A typical flow for Semiconductor Failure Analysis comprises of numerous tasks using methods and tools from different suppliers. Data exchange and sample transfer between tools of different suppliers is not possible today, because each implementation uses different mechanical sample fixtures, different data formats and different data transfer mechanisms.

This SNARF will propose a new standard: Specification for Failure Analysis Reporting. This specification will provide a standardized way to provide information related to Failure Analysis using images as well as synthesized representations of measurement data that look like a picture or photo. This will help to improve quality and speed up the Failure Analysis, e.g by defining consistent measurement units, the same context and metadata reported by different implementations at several equipment manufacturers and tools. This will also help with the additional analysis of the metadata by other software applications by ensuring a consistent baseline and reference points.
This Standard could be implemented by failure analysis tools producing measurement data and images using destructive as well as nondestructive techniques. E.g. implementations working with optical microscopy, X-Ray microscopy, Scanning Acoustic, Scanning Electron Microscopy, Focused Ion Beam, Mechanical and Laser preparation tools, Equipment for Failure Localization.
This Standard could be used by analysis tools as well as equipment users on the factory floor or in other departments in industry.

A separate SNARF will also propose a new subordinate standard to Specification for Failure Analysis Reporting. This subordinate standard will specify the implementation of Failure Analysis Reporting using the JavaScript Object Notation (JSON) protocol.

A different SNARF 7310 under the Physical Interfaces & Carriers (PIC) Technical Committee is working on a definition of a universal sample holder (physical attributes).



b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: Semiconductor Failure Analysis

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Specification

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 06/01/2023b. 1st Draft by: 11/01/2024
c. (Optional) Informational Ballot by: 02/01/2025d. Letter Ballot by: 02/01/2025
e. TC Chapter Approval By:03/01/2025

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will not be issued

Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required



NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
took place between (put dates below) before approval by the GCS, or

Member Review Start Date; 3/12/2025
Member Review End Date: 3/26/2025

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS04/25/2025
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on