SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 02/18/2026Revised (if Applicable):

Document Number: 7464
SNARF for: New Standard: Guide for Using Pressure Measurement Film for Wafer Surface Pressure Mapping in Equipment Alignment Processes

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: Japan
Task Force (TF) in which work is to be carried out: Wafer Surface Pressure Mapping by Pressure Measurement Film TF
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
In advanced semiconductor manufacturing, precise pressure‑uniform alignment is essential for wafer/die bonding, TIM attachment, and wafer‑level compression molding and related operations. Pressure measurement films enable visualization of pressure distribution (and time‑dependent drift), supporting setup optimization and preventive maintenance across these operations. However, usage and interpretation still vary, limiting comparability. A standardized guide is needed to define appropriate usage practices, measurement considerations, and key parameters.
Pressure measurement films are widely used to obtain qualitative and semi‑quantitative contact pressure distribution. However, their usage conditions, interpretation criteria, and handling practices vary significantly among equipment suppliers, device manufacturers, and material vendors. This lack of harmonization leads to inconsistent evaluation results, limits cross‑company data comparability and complicates root‑cause analysis during alignment troubleshooting.
A standardized guide is therefore required to harmonize usage practices, define key measurement considerations, and clarify essential parameters for applying pressure measurement films in alignment processes. Establishing such a guideline will improve reproducibility, enable more reliable benchmarking across companies, and strengthen alignment control throughout the industry. It will also enhance communication between equipment makers, end users, and material suppliers by providing a shared technical basis.


b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: Advanced semiconductor packaging sectors, including WLP, PLP, 2.5D/3D integration, and other alignment‑dependent processes.

c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement is anticipated

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This Standards Document provides a guideline for the use of pressure measurement films to map surface pressure distribution in semiconductor equipment alignment processes. The scope includes:
ž Application of pressure measurement films in wafer bonding, die bonding, wafer‑level compression molding, TIM attachment, and other alignment‑dependent operations.
ž Recommended practices for film selection, handling, placement, and post‑process evaluation.
ž Description of key parameters affecting measurement results, including applied load, temperature/humidity, alignment mechanism, and surface conditions.
ž Procedures for visualizing and interpreting pressure distribution patterns obtained from measurement films.
ž Guidance on documenting measurement conditions to improve reproducibility and enable cross‑tool or cross‑site comparison.
This document does not define pressure measurement film specifications, equipment performance criteria, or acceptance limits for bonding or alignment quality. It is intended solely as a usage guideline to promote consistent application and interpretation of pressure measurement films across the industry.

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Guide

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 03/09/2026b. 1st Draft by: 06/30/2026
c. (Optional) Informational Ballot by: d. Letter Ballot by: 07/31/2026
e. TC Chapter Approval By:12/31/2026

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will not be issued

Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will incorporate Copyrighted Item



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 02/18/2026
Member Review End Date: 03/04/ 2026

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS03/09/2026
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on