SEMI International Standards TASK FORCE ORGANIZATION FORM (TFOF)

Date Prepared: 09/01/2025

Revised (if Applicable):

Name of Task Force (TF): 310mm Square Panel FOUP Task Force

Global Technical Committee: Physical Interfaces & Carriers

Originating Technical Committee Region: Japan

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1. Charter: (State the objective of the proposed TF.)
Develop FOUP standard for 310mm square panels that can be used in advanced packaging factories using existing infrastructure such as load ports and AMHS.
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2. Scope: (Define the specific activities that the TF will conduct.)
The TF will focus on developing FOUP standards for 310mm square panels, including but not necessarily limited to the following boundary conditions:- 20mm pitch- 13 panel capacity- 300mm wafer FOUP, Loadport BOLTS (E63) compatible- copy / reuse as much of the existing 300mm carrier standards as possible
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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Panel Level Packaging (PLP) Panel Task Force under NA 3D Packaging and Integration TC
NA PIC TC
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4. Formation Date:(TF formed on)

Task Force formed on: 09/01/2025
Task Force approved by Committee/GCS on: 09/26/2025

5. Comments
None.