SEMI International Standards TASK FORCE ORGANIZATION FORM (TFOF)

Date Prepared: 05/15/2026

Revised (if Applicable):

Name of Task Force (TF): 310 mm Square Panel Glass Carrier Task Force

Global Technical Committee: 3D Packaging and Integration

Originating Technical Committee Region: Japan

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1. Charter: (State the objective of the proposed TF.)
This TF is chartered to develop revisions to SEMI 3D23 to include specifications for 310 mm square glass carriers used in panel level packaging.
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2. Scope: (Define the specific activities that the TF will conduct.)
This Task Force will define and revise the specifications for 310 mm square glass carriers and incorporate them into SEMI 3D23, which currently covers 510 mm × 515 mm and 600 mm × 600 mm panel sizes.
The scope includes:
- Dimensional requirements, including length, width, thickness, and associated tolerances for the 310 mm panel
- Orientation features, such as the orientation corner and reference edges
- Backside ID mark location and related specifications
- Other necessary specifications
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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)

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4. Formation Date:(TF formed on)

Task Force formed on: 06/05/2026
Task Force approved by Committee/GCS on: 06/05/2026

5. Comments
None.