SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
10/06/2025
Revised (if Applicable):
03/09/2026
Name of Task Force (TF):
Wafer Surface Pressure Mapping by Pressure Measurement Film TF
Global Technical Committee:
3D Packaging and Integration
Originating Technical Committee Region:
Japan
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1. Charter:
(State the objective of the proposed TF.)
This Task Force aims to establish a Guide for evaluating load uniformity of wafer bonding equipment using pressure measurement films. The Guide will specify appropriate material selection based on measurable pressure range, setting measurement conditions considering influencing factors such as temperature, humidity, and pressing time, and standard analysis methods for calculating and evaluating pressure distribution.
Standardizing this evaluation method will make it easier for equipment manufacturers to appeal alignment performance to customers, and for users such as foundries and OSATs to improve equipment management efficiency and quickly identify problems when defects occur. Ultimately, the goal is to improve the accuracy of semiconductor manufacturing process management and contribute to the development of the semiconductor industry as a whole.
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2. Scope:
(Define the specific activities that the TF will conduct.)
This standard specifies guidelines for determining load uniformity using pressure measurement film for alignment of wafer bonding equipment.
Key elements of standardization include:
- Pressure measurement mechanism (coloration mechanism of pressure measurement sheet, factors affecting color density, etc.)
- Pressure measurement conditions (temperature, humidity, material selection & storage, effective period, etc.)
- Pressure measurement procedures
- Analysis methods for pressure measurement data
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
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4. Formation Date:
(TF formed on)
Task Force formed on:
10/06/2025
Task Force approved by Committee/GCS on:
10/06/2025
5. Comments
None.
