SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
02/24/2025
Revised (if Applicable):
Name of Task Force (TF):
Manufacturing Equipment Installation Task Force
Global Technical Committee:
Facilities
Originating Technical Committee Region:
North America
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1. Charter:
(State the objective of the proposed TF.)
Within the semiconductor industry, the diversity and complexity of equipment creates difficult challenges for facilities design and equipment installation. There are several SEMI standards that cover this scope; E6, E51, and E76, which up for review, as well as the new F122. These documents benefit equipment suppliers and semiconductor manufacturers by communicating, in a standardized way, the information necessary to prepare the facility and to efficiently install semiconductor equipment.
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2. Scope:
(Define the specific activities that the TF will conduct.)
Oversee, manage, review, and maintain the standards and guidelines related to the installation of semiconductor manufacturing equipment, which are currently identified as the following:
· F122 - Guide for Facilities Data Package for Manufacturing Equipment Installation And Building Information Modeling (new Feb 2025)
· E6 - Guide for Semiconductor Equipment Installation Documentation (2021 reject with comments)
· E51 – Guide for Typical Facilities Services And Termination Matrix (SNARF cancelled in 2017)
· E76 - Guide for 300 Mm Process Equipment Points of Connection To Facility Services (Feb 2000)
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
None
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4. Formation Date:
(TF formed on)
Task Force formed on:
02/25/2025
Task Force approved by Committee/GCS on:
02/25/2025
5. Comments
Previously BIM TF, revised TFOF during NA Winter Meetings 2025
TFOF_BIM_rev1.doc
