SEMI International Standards TASK FORCE ORGANIZATION FORM (TFOF)

Date Prepared: 06/30/2025

Revised (if Applicable):

Name of Task Force (TF): 3D Packaging Smart Manufacturing Task Force

Global Technical Committee: 3D Packaging and Integration

Originating Technical Committee Region: Taiwan

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1. Charter: (State the objective of the proposed TF.)
The Task Force is chartered to develop, create, and maintain SEMI Standards related to the mechanical and software interface for 3D package larger than 136x136mm2 carrier & transfer systems. The scope includes defining key dimensions, sensor locations, and communication protocols required for cross-platform compatibility among OEM equipment. This work supports the automation and standardization of advance packaging semiconductor fabs.
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2. Scope: (Define the specific activities that the TF will conduct.)
This activity will define mechanical dimensions, tolerances, and sensor alignment zones for tray/boat carrier, tray cassette/boat magazine transfer systems operating in advance packaging fabs.The scope includes horizontal transfer arms, vertical lift mechanisms, and associated fiducial positioning.It excludes pod mapping or RFID communication protocols
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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
No formal linkages with other regional Task Forces at this time.
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4. Formation Date:(TF formed on)

Task Force formed on: 08/14/2025
Task Force approved by Committee/GCS on: 08/14/2025

5. Comments
None.