SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 05/16/2024Revised (if Applicable):

Document Number: 7251
SNARF for: New Standard: Specification for Tungsten Wire Electroplated Diamond Wire for Photovoltaic Silicon Wafer Cutting

Originating Global Technical Committee: Photovoltaic (PV) - Materials
Originating TC Chapter: China
Task Force (TF) in which work is to be carried out: PV Silicon Wafer Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)

With the continuous growth of the world's energy demand and the strengthening of environmental protection, the promotion and application of clean energy has become an inevitable trend. Photovoltaic power generation as a clean energy way is getting more and more attention. It is expected that from 2024 to 2026, the global new installed photovoltaic capacity is expected to reach 530,630 and 730GW respectively. Now, the electroplating diamond wire, as an efficient and environmentally friendly cutting material, has been widely used in the photovoltaic silicon wafer cutting field because of its excellent characteristics of wear resistance, efficient cutting speed and long service life.

Due to the continuous development of the global photovoltaic industry, the silicon wafer cutting industry continues to put forward higher requirements for diamond wire cutting in the direction of fine line. However, the breaking force of high carbon steel wire after the reduction of wire diameter cannot meet the requirements of silicon wafer cutting.

Tungsten has high melting point, high wear resistance, high hardness, stronger tensile strength, and can make the line diameter more fine under the same breaking force. Therefore, the use of tungsten wire diamond wire cutting for photovoltaic silicon wafers is becoming increasingly widespread recently.

However, there are great differences in the quality of tungsten wire electroplating diamond wire in the current market, and there is a lack of unified standard specification, which leads to the instability of cutting effect and has a serious impact on the quality and production efficiency of photovoltaic products.

In order to solve this problem, it is particularly critical to formulate the relevant standards of tungsten wire electroplating diamond wire for photovoltaic silicon wafer cutting. The formulation of unified standards will standardize the quality of products in the market, improve the stability of the cutting effect, and promote the healthy development of the photovoltaic industry. At the same time, it also helps to promote the innovation and application of photovoltaic silicon wafer cutting technology.

In the field of related products, China has formulated industry standards: superabrasive products-electroplating diamond wire (JB/T-12543-2015)and electroplated diamond wire for photovoltaic silicon wafer cutting (T / CPIA 0038-2022).However, given that the early standards were based on high carbon steel wire, there is no relevant product standard issued based on tungsten wire.

For the above reasons, it is particularly urgent to develop new standard.

The standard establishes a project for the above-mentioned industry problems, which stipulates general standards for tungsten wire electroplated diamond wire for photovoltaic silicon wafer cutting.




b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information:
PV, Wafer, Photovoltaic silicon wafer cutting


c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This document applies to tungsten wire electroplated diamond wire for photovoltaic silicon wafer cutting.

This standard specifies the terms and definitions, product classification and marking, technical requirements and the related test methods (such as rupture stress, diamond particle density, free circle diameter, head bending height, winding spacing and so on), inspection rules, packaging, marking, transportation and storage, and recycling of waste tungsten wire electroplated diamond wire for photovoltaic silicon wafer cutting.

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Specification

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 05/01/2024b. 1st Draft by: 10/01/2024
c. (Optional) Informational Ballot by: d. Letter Ballot by: 01/01/2025
e. TC Chapter Approval By:12/01/2025

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
Photovoltaic
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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
took place between (put dates below) before approval by the GCS, or

Member Review Start Date; 04/29/2024
Member Review End Date: 05/14/2024

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS05/16/2024
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on