SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)

Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.

The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.

If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the contact information page.

Blank forms：
TFOF (DOC 115K) (Sept 2024)
SNARF (DOC 133K) (April 2026)

The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.

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Show details for 3D Packaging and Integration3D Packaging and Integration
Show details for Automated Test EquipmentAutomated Test Equipment
Show details for Automation TechnologyAutomation Technology
Show details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Show details for EH&SEH&S
Show details for FacilitiesFacilities
Show details for Flat Panel Display (FPD) - Materials & ComponentsFlat Panel Display (FPD) - Materials & Components
Show details for Flat Panel Display (FPD) - MetrologyFlat Panel Display (FPD) - Metrology
Show details for Flexible Hybrid Electronics (FHE)Flexible Hybrid Electronics (FHE)
Show details for GasesGases
Show details for HB-LEDHB-LED
Hide details for Information & ControlInformation & Control
Hide details for ChinaChina
Show details for Advanced Backend Factory Integration Task ForceAdvanced Backend Factory Integration Task Force
Show details for Diagnostic Data Acquisition Task ForceDiagnostic Data Acquisition Task Force
Hide details for GEM300 Task ForceGEM300 Task Force
7139Line Item Revisions to E40-0324, Specification For Processing Management and E40.1-1218 (Reapproved 0324), Specification For SECS-II Protocol For Processing Management
7140Line Item Revisions to E94-0324, Specification For Control Job Management and E94.1-0312 (Reapproved 0324), Specification For SECS-II Protocol For Control Job Management (CJM)
7475Line Item Revision to E90-1224, SPECIFICATION FOR SUBSTRATE TRACKING and E90.1-1224, SPECIFICATION FOR SECS-II PROTOCOL SUBSTRATE TRACKING
TFOFGEM300 Task Force
Show details for JapanJapan
Show details for KoreaKorea
Show details for North AmericaNorth America
Show details for TaiwanTaiwan
Show details for Liquid ChemicalsLiquid Chemicals
Show details for MEMS / NEMSMEMS / NEMS
Show details for MetricsMetrics
Show details for MicropatterningMicropatterning
Show details for PhotovoltaicPhotovoltaic
Show details for Photovoltaic (PV) - MaterialsPhotovoltaic (PV) - Materials
Show details for Physical Interfaces & CarriersPhysical Interfaces & Carriers
Show details for Silicon WaferSilicon Wafer
Show details for TraceabilityTraceability

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