SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)

Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.

The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.

If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the contact information page.

Blank forms：
TFOF (DOC 115K) (Sept 2024)
SNARF (DOC 133K) (April 2026)

The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.

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Show details for 3D Packaging and Integration3D Packaging and Integration
Show details for Automated Test EquipmentAutomated Test Equipment
Show details for Automation TechnologyAutomation Technology
Show details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Show details for EH&SEH&S
Show details for FacilitiesFacilities
Show details for Flat Panel Display (FPD) - Materials & ComponentsFlat Panel Display (FPD) - Materials & Components
Show details for Flat Panel Display (FPD) - MetrologyFlat Panel Display (FPD) - Metrology
Show details for Flexible Hybrid Electronics (FHE)Flexible Hybrid Electronics (FHE)
Show details for GasesGases
Show details for HB-LEDHB-LED
Show details for Information & ControlInformation & Control
Show details for Liquid ChemicalsLiquid Chemicals
Show details for MEMS / NEMSMEMS / NEMS
Show details for MetricsMetrics
Show details for MicropatterningMicropatterning
Show details for PhotovoltaicPhotovoltaic
Show details for Photovoltaic (PV) - MaterialsPhotovoltaic (PV) - Materials
Hide details for Physical Interfaces & CarriersPhysical Interfaces & Carriers
Show details for InternationalInternational
Show details for JapanJapan
Hide details for North AmericaNorth America
Show details for Electron Microscopy Workflow Task ForceElectron Microscopy Workflow Task Force
Show details for Film Frame FOUP (FFF) Task ForceFilm Frame FOUP (FFF) Task Force
Show details for Integrated Workflows in Failure Analysis Task ForceIntegrated Workflows in Failure Analysis Task Force
Hide details for SEMI E72 Revision Task ForceSEMI E72 Revision Task Force
7195Revision to SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight
7298Revision to SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight, with title change to: Specification and Guide for Equipment Footprint, Height, and Mass
TFOFSEMI E72 Revision Task Force
Show details for “6 x12 inch” Reticle Carrier and Load Port Task Force“6 x12 inch” Reticle Carrier and Load Port Task Force
Show details for Silicon WaferSilicon Wafer
Show details for TraceabilityTraceability

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