SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)

Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.

The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.

If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the contact information page.

Blank forms：
TFOF (DOC 115K) (Sept 2024)
SNARF (DOC 133K) (April 2026)

The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.

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Show details for 3D Packaging and Integration3D Packaging and Integration
Show details for Automated Test EquipmentAutomated Test Equipment
Show details for Automation TechnologyAutomation Technology
Show details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Show details for EH&SEH&S
Show details for FacilitiesFacilities
Show details for Flat Panel Display (FPD) - Materials & ComponentsFlat Panel Display (FPD) - Materials & Components
Show details for Flat Panel Display (FPD) - MetrologyFlat Panel Display (FPD) - Metrology
Show details for Flexible Hybrid Electronics (FHE)Flexible Hybrid Electronics (FHE)
Show details for GasesGases
Show details for HB-LEDHB-LED
Show details for Information & ControlInformation & Control
Show details for Liquid ChemicalsLiquid Chemicals
Show details for MEMS / NEMSMEMS / NEMS
Show details for MetricsMetrics
Show details for MicropatterningMicropatterning
Show details for PhotovoltaicPhotovoltaic
Show details for Photovoltaic (PV) - MaterialsPhotovoltaic (PV) - Materials
Show details for Physical Interfaces & CarriersPhysical Interfaces & Carriers
Hide details for Silicon WaferSilicon Wafer
Show details for EuropeEurope
Show details for InternationalInternational
Hide details for JapanJapan
Show details for International Polished Wafers Task ForceInternational Polished Wafers Task Force
Hide details for International Test Methods Task ForceInternational Test Methods Task Force
6570New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scattering Tomography Technique
6687Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity
7319Line-item revision to SEMI M88-0119, Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods
7392Line-item revision to SEMI M89-0721, Test Method for Recombination Lifetime of the Epilayer of the Silicon Epitaxial Wafer (p/p+, n/n+) by the Short Wavelength Excitation Microwave Photoconductive Decay Method
7437Revision to SEMI M85-0120, Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry
7439Auxiliary Information: BACKGROUND, RATIONALE, AND APPLICATION GUIDELINES FOR SEMI M95:TEST METHOD FOR NET CARRIER DENSITY AND RESISTIVITY OF SILICON EPITAXIAL LAYER BY CAPACITANCE-VOLTAGE MEASUREMENTS WITH AN EVAPORATED METAL SCHOTTKY DIODE
7468Revision to SEMI M95-0925, TEST METHOD FOR NET CARRIER DENSITY AND RESISTIVITY OF SILICON EPITAXIAL LAYER BY CAPACITANCE-VOLTAGE MEASUREMENTS WITH AN EVAPORATED METAL SCHOTTKY DIODE
Show details for Japan TC Chapter of Global Technical TommitteeJapan TC Chapter of Global Technical Tommittee
Show details for Japan Test Method Task ForceJapan Test Method Task Force
Show details for North AmericaNorth America
Show details for TraceabilityTraceability

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