SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 05/10/2018Revised (if Applicable):

Document Number: 5474
SNARF for: Line Item Revision of SEMI 3D6-0913 Guide for CMP and Micro-bump Processes for Frontside TSV Integration

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: Taiwan
Task Force (TF) in which work is to be carried out: 3DP&I Middle-End Process Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
To speed up the volume production of 3DS-IC products, a generic middle-end process flow is needed to communicate the frontend and backend processes. The quality criteria and metrology methodology of the key modules such as TSV, CMP and micro-bump are developed to ensure the high yield of the middle-end process. Therefore, this guide will suggest generic middle-end process flow to define acceptable TSV and CMP quality criteria, and develop methodology and measuring procedure for micro-bump. The guide will provide criteria and common baselines of the middle-end process for related upstream and downstream manufacturers in fabricating the 3DS-IC products.


b. Estimate effect on industry.
4: Slight effect or effect not determinable
Sector or Company Information:

c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement is anticipated

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Propose a frontside TSV integration scheme as one of the generic middle-end process flow. The flow includes steps such as TSV formation, RDL formation, CMP, temporary carrier bonding, wafer thinning, micro-bump formation, carrier debonding, etc.

Define acceptable CMP criteria of TSV in terms of dishing, erosion, and voids. CMP criteria can be determined by metrology technology such as Alpha stepper, Ultrasonic, Coherence Interferometry, and etc. TSV formation and reveal are significantly dependent on the performance of CMP process. The outcome of the high CMP quality yields better TSV connectivity.

Develop criteria for measurement methodology for micro-bump dimensions, including sampling rate, sampling sites and mapping, reference datum, and survey available metrology tools. The outcome will be an important bridge communication between IC design firms and associated foundry and packaging fabs. The assumption of DWL and DDL are that testing data is available for known good die status.


b: Expected result of activity
Reapproval of a Standard or Safety Guideline

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Specification

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 05/10/2018b. 1st Draft by: 05/10/2018
c. (Optional) Informational Ballot by: 05/10/2018d. Letter Ballot by: 05/10/2018
e. TC Chapter Approval By:05/10/2018

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)


b. Intercommittee Ballots:
will not be issued

Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s).

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include reproduced copyrighted material



NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 16 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
is not required for this SNARF.

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
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9.. SNARF Approval Dates:
TC Chapter or GCS05/10/2018
Recorded in TC Minutes
Attach Pictures and Files here:
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