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 | 3D Packaging and Integration |
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 | Automated Test Equipment |
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 | Automation Technology |
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 | Compound Semiconductor Materials |
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 | EH&S |
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 | Facilities |
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 | Flat Panel Display (FPD) - Materials & Components |
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 | Flat Panel Display (FPD) - Metrology |
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 | Flexible Hybrid Electronics (FHE) |
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 | Gases |
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 | HB-LED |
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 | Information & Control |
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 | China |
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 | Japan |
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 | Korea |
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 | North America |
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 | Advanced Backend Factory Integration |
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| | | 7213 | Line Item Revision to SEMI E142-1022 - Specification for Substrate Mapping, SEMI E142.1-0921E — Specification for XML Schema for Substrate Mapping,
SEMI E142.2-1016 — Specification for SECS II Protocol for Substrate Mapping,
SEMI E142.3-1016 — Specification for Web Services for Substrate Mapping,
SEMI E142.4-1022 — Specification for SECS II Protocol for Substrate Mapping Using Item Transfer |  |
| | | 7236 | Line Item Revision to SEMI E90-0921 - Specification for Substrate Tracking and SEMI E90.1-0312 (Reapproved 0921) - Specification for SECS-II Protocol Substrate Tracking |  |
| | | 7344 | Line Item Revision to SEMI E192-0121 – Guide for Equipment Adoption Criteria for GEM and GEM-Related Standards |  |
| | | 7380 | Line Item Revision to SEMI E142-0225 - Specification for Substrate Mapping,
SEMI E142.1-0225 — Specification for XML Schema for Substrate Mapping,
SEMI E142.2-1016 (0225) — Specification for SECS II Protocol for Substrate Mapping,
SEMI E142.3-1016 (0225) — Specification for Web Services for Substrate Mapping,
SEMI E142.4-1022 (0225) — Specification for SECS II Protocol for Substrate Mapping Using Item Transfer |  |
| | | 7381 | Revision to Add a New Subordinate Standard: Specification for Transforming Non-E142 XY Coordinates to SEMI E142-0125: Specification for Substrate Mapping |  |
| | | TFOF | Advanced Backend Factory Integration |  |
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 | Diagnostic Data Acquisition Task Force NA |
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 | Digital Twins in Manufacturing Task Force |
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 | Energy Saving Equipment Communication Task Force |
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 | Equipment Data Publication (EDP) Task Force |
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 | Fab & Equipment Computer and Device Security (CDS) Task Force |
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 | GEM 300 Task Force |
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 | Graphical User Interfaces (GUI) Task Force |
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 | NA Information and Control Committee |
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 | Process Control System NA |
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 | Sensor Bus Task Force |
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 | Taiwan |
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 | Liquid Chemicals |
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 | MEMS / NEMS |
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 | Metrics |
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 | Micropatterning |
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 | Photovoltaic |
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 | Photovoltaic (PV) - Materials |
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 | Physical Interfaces & Carriers |
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 | Silicon Wafer |
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 | Traceability |
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