SEMI International Standards
Committee Meeting Minutes
Below you will find the committee minutes for all the regional committees within the SEMI Standards Program. These minutes are the official records for all committee and document activity.
Note that the list below is by the Global Technical Committee, with the most recent committee meeting listed first.
Click here to view Committee Meeting Minutes prior to December 31, 2012
Navigation Tips:
1. Click on the "twistie" 
to view the items under each heading.
2. To use the display navigator bar, click on:
EXPAND - to expand all sections
COLLAPSE - to collapse all sections.
Expand | Collapse
 | 3D Packaging and Integration |
| |
 | Feb 5, 2018 | | | | | | Japan 3D Packaging and Integration | | | | | | Available in English | | |
| Nov 7, 2017 | | | | | | North America 3D Packaging and Integration | | | | | | Available in English | | |
| Sep 26, 2017 | | | | | | Taiwan 3D Packaging and Integration | | | | | | Available in English | | |
| Sep 13, 2017 | | | | | | Japan 3D Packaging and Integration | | | | | | Available in English | | |
| Jul 24, 2017 | | | | | | Japan 3D Packaging and Integration | | | | | | Available in English | | |
| Jun 29, 2017 | | | | | | Taiwan 3D Packaging and Integration | | | | | | Available in English | | |
| Jun 29, 2017 | | | | | | Taiwan 3D Packaging and Integration | | | | | | Available in English | | |
| 3DS-IC |
| |
|
| |
| Automated Test Equipment |
| |
|
| |
| Compound Semiconductor Materials |
| |
|
| |
| Facilities |
| |
| FPD - Materials & Components |
| |
| FPD - Metrology |
| |
|
| |
| Gases & Facilities |
| |
|
| |
| Information & Control |
| |
|
| |
| MEMS / NEMS |
| |
|
| |
| Micropatterning |
| |
|
| |
| Photovoltaic - Automation |
| |
|
| |
| Physical Interfaces & Carriers |
| |
|
| |
| Traceability |
| |
|
| |
Expand | Collapse
Copyright ©2018 Semiconductor Equipment and Materials International (SEMI®). All rights reserved.