Global Committee Meeting Minutes


SEMI International Standards
Committee Meeting Minutes

Below you will find the committee minutes for all the regional committees within the SEMI Standards Program. These minutes are the official records for all committee and document activity.

Note that the list below is by the Global Technical Committee, with the most recent committee meeting listed first.

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Hide details for 3D Packaging and Integration3D Packaging and Integration
May 16, 2022 Japan 3D Packaging and Integration Available in English
Mar 4, 2022 Taiwan 3D Packaging and Integration Available in English
Jan 18, 2022 Japan 3D Packaging and Integration Available in English
Dec 8, 2021 North America 3D Packaging and Integration Available in EnglishMinutes have not been reviewed
Oct 22, 2021 Japan 3D Packaging and Integration Available in English
Aug 13, 2021 Taiwan 3D Packaging and Integration Available in English
Jul 15, 2021 North America 3D Packaging and Integration Available in EnglishMinutes have not been reviewed
May 28, 2021 Japan 3D Packaging and Integration Available in English
Mar 23, 2021 North America 3D Packaging and Integration Available in English
Mar 2, 2021 Taiwan 3D Packaging and Integration Available in EnglishMinutes have not been reviewed
Jan 18, 2021 Japan 3D Packaging and Integration Available in English
Aug 26, 2020 Taiwan 3D Packaging and Integration Available in English
Jul 10, 2020 Japan 3D Packaging and Integration Available in English
Mar 6, 2020 Japan 3D Packaging and Integration Available in English
Nov 7, 2019 North America 3D Packaging and Integration Available in English
Oct 11, 2019 Japan 3D Packaging and Integration Available in English
Jul 11, 2019 North America 3D Packaging and Integration Available in English
Jun 11, 2019 Taiwan 3D Packaging and Integration Available in English
Jun 7, 2019 Japan 3D Packaging and Integration Available in English
Apr 4, 2019 North America 3D Packaging and Integration Available in English
Mar 26, 2019 Taiwan 3D Packaging and Integration Available in English
Feb 22, 2019 Japan 3D Packaging and Integration Available in English
Dec 18, 2018 Taiwan 3D Packaging and Integration Available in English
Nov 8, 2018 North America 3D Packaging and Integration Available in English
Oct 15, 2018 Japan 3D Packaging and Integration Available in English
Sep 25, 2018 Taiwan 3D Packaging and Integration Available in English
Jul 12, 2018 North America 3D Packaging and Integration Available in English
May 21, 2018 Japan 3D Packaging and Integration Available in English
May 10, 2018 Taiwan 3D Packaging and Integration Available in English
Apr 10, 2018 North America 3D Packaging and Integration Available in English
Feb 5, 2018 Japan 3D Packaging and Integration Available in English
Jan 9, 2018 Taiwan 3D Packaging and Integration Available in English
Nov 7, 2017 North America 3D Packaging and Integration Available in English
Sep 26, 2017 Taiwan 3D Packaging and Integration Available in English
Sep 13, 2017 Japan 3D Packaging and Integration Available in English
Jul 24, 2017 Japan 3D Packaging and Integration Available in English
Jul 12, 2017 North America 3DS-IC Available in EnglishMinutes have not been reviewed
Jun 29, 2017 Taiwan 3D Packaging and Integration Available in English
Jun 29, 2017 Taiwan 3D Packaging and Integration Available in English
Show details for 3DS-IC3DS-IC
Show details for Assembly & PackagingAssembly & Packaging
Show details for Automated Test EquipmentAutomated Test Equipment
Show details for Automation TechnologyAutomation Technology
Show details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Show details for EHSEHS
Show details for FacilitiesFacilities
Show details for Flexible Hybrid Electronics (FHE)Flexible Hybrid Electronics (FHE)
Show details for FPD - Materials & ComponentsFPD - Materials & Components
Show details for FPD - MetrologyFPD - Metrology
Show details for GasesGases
Show details for HB-LEDHB-LED
Show details for Information & ControlInformation & Control
Show details for Liquid ChemicalsLiquid Chemicals
Show details for MEMS / NEMSMEMS / NEMS
Show details for MetricsMetrics
Show details for MicropatterningMicropatterning
Show details for PhotovoltaicPhotovoltaic
Show details for Photovoltaic - MaterialsPhotovoltaic - Materials
Show details for Physical Interfaces & CarriersPhysical Interfaces & Carriers
Show details for Silicon WaferSilicon Wafer
Show details for TraceabilityTraceability

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