| | | | | |
| 3D Packaging and Integration |
| |
|
| Japan |
| |
|
| 3D Packaging & Integration 5 Year Review Task Force |
| |
| | | TFOF | 3D Packaging & Integration 5 Year Review Task Force | |
|
| 3DS IC Bonded Layer Inspection Metrology TF |
| |
| | | TFOF | 3DS IC Bonded Layer Inspection Metrology TF | |
|
| JA 450mm Assembly and Test Die Preparation Task Force |
| |
| | | TFOF | JA 450mm Assembly and Test Die Preparation Task Force | |
|
| Wafer Bond Strength Measurement by Double-cantilever Beam Task Force |
| |
| | | TFOF | Wafer Bond Strength Measurement by Double-cantilever Beam Task Force | |
|
| North America |
| |
|
| 3DP&I Bonded Wafer Stacks Task Force |
| |
| | | TFOF | 3DP&I Bonded Wafer Stacks Task Force | |
|
| 3DP&I Inspection and Metrology Task Force |
| |
| | | 7099 | Revision to SEMI 3D3-0613 (Reapproved 1218), Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames | |
| | | 7100 | Revision to SEMI 3D4-0915 (Reapproved 0222), Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks | |
| | | 7101 | Revision to SEMI 3D5-0314 (Reapproved 1218), Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures | |
| | | 7102 | Revision to SEMI 3D17-1217, Specification for Reference Material for Bonded Wafer Stack Void Metrology | |
| | | TFOF | 3DP&I Inspection and Metrology Task Force | |
|
| Panel Level Packaging (PLP) Panel Task Force |
| |
| | | TFOF | Panel Level Packaging (PLP) Panel Task Force | |
|
| Taiwan |
| |
|
| 3DP&I Middle-End Process Task Force |
| |
| | | TFOF | 3DP&I Middle-End Process Task Force | |
|
| 3DP&I Testing Task Force |
| |
| | | 6921 | New Standard:Guide for Adding Maximum Allowable Current (MAC) Information for Wafer Testing Probe | |
| | | TFOF | 3DP&I Testing Task Force | |
| Automated Test Equipment |
| |
|
| North America |
| |
|
| NA ATE 5-Year Review |
| |
| | | TFOF | NA ATE 5-Year Review | |
|
| Rich Interactive Test Database (RITdb) |
| |
| | | 6973 | New Standard: Guide for Generic Model on Manufacturing Flow Impacting Semiconductor Test | |
| | | 6974 | New Standard: Specification for Rich Interactive Test Database Event Message Content | |
| | | TFOF | Rich Interactive Test Database (RITdb) | |
|
| Standard Test Data Format (STDF) Task Force |
| |
| | | TFOF | Standard Test Data Format (STDF) Task Force | |
|
| Test Cell Communications |
| |
| | | TFOF | Test Cell Communications | |
|
| Tester Event Messaging for Semiconductors (TEMS) |
| |
| | | TFOF | Tester Event Messaging for Semiconductors (TEMS) | |
| Automation Technology |
| |
|
| Japan |
| |
|
| A1 TF |
| |
| | | TFOF | A1 TF | |
|
| F-GEM TF |
| |
| | | TFOF | F-GEM TF | |
|
| SMT TF |
| |
| | | 7168 | Line Item Revision to SEMI A2-0722 Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | TFOF | SMT TF | |
|
| Taiwan |
| |
|
| Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force |
| |
| | | TFOF | Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force | |
| Compound Semiconductor Materials |
| |
|
| China |
| |
|
| SiC Epitaxial Wafer Task Force |
| |
| | | TFOF | SiC Epitaxial Wafer Task Force | |
|
| Silicon Carbide Substrate Task Force |
| |
| | | 6767 | New Standard: Test Method for GBIR, SBIR, GF3R, SFQR and SORI of Silicon Carbide Wafers by Oblique Incident Interference Method | |
| | | 6769 | New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic | |
| | | TFOF | Silicon Carbide Substrate Task Force | |
|
| Europe |
| |
|
| 5 Year Review Task Force |
| |
| | | 7233 | Line Item Revision of SEMI M54 – Guide for Semi-Insulating (SI) GaAs Material Parameters | |
| | | TFOF | 5 Year Review Task Force | |
|
| EU Compound Semiconductor Materials Committee |
| |
| | | TFOF | EU Compound Semiconductor Materials Committee | |
|
| SiC Epi Defects Task Force |
| |
| | | 7160 | New Standard: Guide for Defects found in Homoepitaxial Layers of Silicon Carbide | |
| | | TFOF | SiC Epi Defects Task Force | |
|
| SiC Material and Wafer Specification TF |
| |
| | | 7111 | Revision of SEMI M81 Guide to Defects Found in Monocrystalline Silicon Carbide Substrates | |
| | | TFOF | SiC Material and Wafer Specification TF | |
|
| Silicon Carbide Engineered Substrate Task Force |
| |
| | | 7225 | New standard: Specification for Silicon Carbide Engineered Substrate | |
| | | TFOF | Silicon Carbide Engineered Substrate Task Force | |
|
| Test Methods Task Force |
| |
| | | TFOF | Test Methods Task Force | |
|
| Japan |
| |
|
| SiC Epitaxial Wafer liaison TF |
| |
| | | 7211 | Line Item Revision of SEMI M92-0423 Specification for 4H-SiC Homoepitaxial Wafer | |
| | | TFOF | SiC Epitaxial Wafer liaison TF | |
|
| Silicon Carbide Substrate liaison TF |
| |
| | | TFOF | Silicon Carbide Substrate liaison TF | |
|
| North America |
| |
|
| M86 Revision Task Force |
| |
| | | TFOF | M86 Revision Task Force | |
|
| M9 Revision Task Force |
| |
| | | TFOF | M9 Revision Task Force | |
| EH&S |
| |
|
| Japan |
| |
|
| Japan Environmental Health and Safety Committee |
| |
| | | TFOF | Japan Environmental Health and Safety Committee | |
|
| Japan S2 major revision liaison TF (JA-S2 revision LTF) |
| |
| | | TFOF | Japan S2 major revision liaison TF (JA-S2 revision LTF) | |
|
| S18 Revision Task Force |
| |
| | | 6289 | Revision to SEMI S18-0312: ENVIRONMENTAL, HEALTH AND SAFETY GUIDELINE FOR FLAMMABLE SILICON COMPOUNDS | |
| | | TFOF | S18 Revision Task Force | |
|
| Japan and North America |
| |
|
| Global Seismic Protection TF |
| |
| | | TFOF | Global Seismic Protection TF | |
|
| S23 Revision Global Task Force |
| |
| | | TFOF | S23 Revision Global Task Force | |
|
| North America |
| |
|
| Control of Hazardous Energy (CoHE) Task Force |
| |
| | | 6942 | Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Related to CoHE/LOTO section of S2) | |
| | | TFOF | Control of Hazardous Energy (CoHE) Task Force | |
|
| EH&S Committee |
| |
| | | 7159 | Reapproal of SEMI S25, Safety Guideline for Hydrogen Peroxide Storage & Handling Systems | |
|
| Energetic Materials EHS Task Force |
| |
| | | TFOF | Energetic Materials EHS Task Force | |
|
| Environmental Performance Rating (EPR) Task Force |
| |
| | | TFOF | Environmental Performance Rating (EPR) Task Force | |
|
| Ergonomics Task Force |
| |
| | | 7134 | Revision to SEMI S8-0218, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment | |
| | | TFOF | Ergonomics Task Force | |
|
| Fire Protection Task Force |
| |
| | | 6784 | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Changes to materials of construction criterion in fire and smoke risk for pre-evaluation figure)
| |
| | | TFOF | Fire Protection Task Force | |
|
| Flammable Gas Task Force |
| |
| | | 6980 | Line Item Revisions to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re:Flammable gas) | |
| | | TFOF | Flammable Gas Task Force | |
|
| Manufacturing Equipment Safety Subcommittee |
| |
| | | TFOF | Manufacturing Equipment Safety Subcommittee | |
|
| NA Environmental Health and Safety Committee |
| |
| | | TFOF | NA Environmental Health and Safety Committee | |
|
| S1 Revision Task Force |
| |
| | | 7108 | Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (labels) | |
| | | TFOF | S1 Revision Task Force | |
|
| S10 Task Force |
| |
| | | 7109 | Line Item Revisions to SEMI S1, S2, S10, S14, and S30 (regarding risk to buildings/facilities) | |
| | | 7169 | Revision of SEMI S10-0423 Safety Guideline for Risk Assessment and Risk Evaluation Process | |
| | | TFOF | S10 Task Force | |
|
| S12 (Equipment Decon) Review Task Force |
| |
| | | 6888 | Revision of SEMI S12-0211e, Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination | |
| | | TFOF | S12 (Equipment Decon) Review Task Force | |
|
| S2 Major Revision Task Force |
| |
| | | TFOF | S2 Major Revision Task Force | |
|
| S2 Mechanical Design Task Force |
| |
| | | 7158 | Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Section 18 and section 5) | |
| | | TFOF | S2 Mechanical Design Task Force | |
|
| S23 Revision Global Task Force |
| |
| | | 7135 | Revision of SEMI S23-1021E2 - Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment | |
|
| S2/S22 Task Force |
| |
| | | 7021 | Line Items Revisions of S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and S22 Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment | |
| | | TFOF | S2/S22 Task Force | |
|
| S3 Revision Task Force |
| |
| | | 6830 | Revision to SEMI S3-1211 (Reapproved 1017)E SAFETY GUIDELINE FOR PROCESS LIQUID HEATING SYSTEMS | |
| | | TFOF | S3 Revision Task Force | |
|
| S6 Revision Task Force |
| |
| | | 7133 | Revision of SEMI S6-0618 - Environmental, Health, and Safety Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment
| |
| | | TFOF | S6 Revision Task Force | |
|
| S7 Task Force |
| |
| | | 6907 | Revision to SEMI S7-0515 Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications | |
| | | TFOF | S7 Task Force | |
|
| Taiwan |
| |
|
| Equipment Safety Task Force |
| |
| | | TFOF | Equipment Safety Task Force | |
| Facilities |
| |
|
| Japan |
| |
|
| 5-year-review TF |
| |
| | | 7205 | Line Item Revision to SEMI F44-0307 (Reapproved 0818), Specification for Machined Stainless Steel Weld Fittings | |
| | | 7206 | Line Item Revision to SEMI F45-0307 (Reapproved 0818), Specification for Machined Stainless Steel Reducing Weld Fittings | |
| | | TFOF | 5-year-review TF | |
|
| F1 Revision TF |
| |
| | | TFOF | F1 Revision TF | |
|
| Gas Box Components Joint Task Force |
| |
| | | TFOF | Gas Box Components Joint Task Force | |
|
| Japan Gases and Facilities Committee |
| |
| | | TFOF | Japan Gases and Facilities Committee | |
|
| Korea |
| |
|
| Voltage Sag Immunity Task Force |
| |
| | | TFOF | Voltage Sag Immunity Task Force | |
|
| North America |
| |
|
| Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force |
| |
| | | 6628 | New Standard: Guide for Facilities Data Package for Semiconductor Manufacturing Equipment Installation and Building Information Modeling | |
| | | TFOF | Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force | |
|
| NA Facilities Committee |
| |
| | | 6771 | Reapproval of SEMI E6-0914, Guide for Semiconductor Equipment Installation Documentation | |
| | | 6773 | Reapproval of SEMI E76-0299 (Reapproved 0913), Guide for 300 mm Process Equipment Points of Connection to Facility Services | |
| | | TFOF | NA Facilities Committee | |
|
| Power Grid Harmonics Task Force |
| |
| | | TFOF | Power Grid Harmonics Task Force | |
|
| SEMI F51 Revision Task Force |
| |
| | | TFOF | SEMI F51 Revision Task Force | |
|
| Voltage Sag Immunity Task Force |
| |
| | | 7196 | Revision to SEMI F47-0706 (Reapproved 0812), Specification for Semiconductor Processing Equipment Voltage Sag Immunity | |
| | | TFOF | Voltage Sag Immunity Task Force | |
| Flat Panel Display (FPD) - Materials & Components |
| |
|
| Japan |
| |
|
| Flexible Display Task Force |
| |
| | | 7110 | Revision to SEMI D78: Test Method of Water Vapor Barrier Property for Plastic Films with High Barrier for Electronic Devices, with title change to Test Method of Water Vapor Barrier Property for Plastic Films with High Gas Barrier for Electronic Devices | |
| | | 7218 | Reapproval of SEMI D66-0519: Terminology for Plastic Substrates of Flexible Display | |
| | | TFOF | Flexible Display Task Force | |
|
| FPD Mask Task Force |
| |
| | | 7157 | Line Item Revision to SEMI D38-0723, GUIDE FOR QUALITY AREA OF FLAT PANEL DHISPLAY (FPD) MASKS | |
| | | TFOF | FPD Mask Task Force | |
|
| FPD Materials & Components Maintenance Task Force |
| |
| | | 7105 | Reapproval of SEMI D60-0818: TEST METHOD FOR SURFACE SCRATCH RESISTANCE FOR FPD POLARIZING FILM AND COVER PLASTICS FOR MOBILE DISPLAYS | |
| | | 7106 | REAPPROVARL TO SEMI D63-0818: TEST METHOD FOR DEPOLARIZATION EFFECT OF FPD COLOR FILTER | |
| | | 7107 | Reapproval of SEMI D77-0618: Test Method for Measurements of Dimension of Films for FPD – Contour Matching Method | |
| | | 7215 | Reapproval of SEMI D22-0818: Test Method for the Determination of Color, Transmittance of FPD Color Filter Assemblies | |
| | | 7216 | Reapproval of SEMI D29-0519: Test Method for Heat Resistance in Flat Panel Display Color Filters | |
| | | 7217 | Reapproval of SEMI SEMI D30-0519: Test Method for Light Resistance in Flat Panel Display Color Filters | |
| | | 7219 | Reapproval of SEMI D67-0819: Test method for Antifouling Property and Chemical Resistance of FPD Polarizing Films and Its Materials | |
| | | TFOF | FPD Materials & Components Maintenance Task Force | |
|
| Japan FPD Materials and Components Committee |
| |
| | | TFOF | Japan FPD Materials and Components Committee | |
| Flat Panel Display (FPD) - Metrology |
| |
|
| Korea |
| |
|
| Automotive Display Task Force |
| |
| | | 7155 | New Standard: Test Method for Optical Switchable Properties of Automotive Display | |
|
| Perceptual Image Quality |
| |
| | | TFOF | Perceptual Image Quality | |
|
| Perceptual Viewing Angle |
| |
| | | TFOF | Perceptual Viewing Angle | |
|
| Picture Quality Evaluation Task Force |
| |
| | | 6975 | New Standard, Test Method for Response Time Evaluation of Displays with Variable Refresh Rate | |
| | | 7154 | New Standard: Test Method for Flicker of Flat Panel Displays | |
| | | 7156 | Revision to SEMI D61-0723, Test Method of Perceptual Angle for OLED Dislays with title change to Test Method of Viewing Angle for Flat Panel Displays using Color Volume | |
| | | TFOF | Picture Quality Evaluation Task Force | |
|
| Taiwan |
| |
|
| Flexible Displays Task Force |
| |
| | | 6632 | New Standard: Test Method of Flicker Nuisance for Wide-Visual-Field Displays | |
| | | 7221 | Reapproval of SEMI D62-0619, Test Method for Measurement of LED Light Bar for Liquid Crystal Displays | |
| | | TFOF | Flexible Displays Task Force | |
|
| Maintenance Task Force |
| |
| | | 6960 | Revision to SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection | |
| | | 6961 | Line Item Revision to SEMI D58 Terminology and Test Pattern for the Color Breakup of Field Sequential Color Display | |
| | | TFOF | Maintenance Task Force | |
|
| Transparent Display Task Force |
| |
| | | 6201 | New Standard: Guide for Tone Reproduction Curves for Transparent Displays | |
| | | 6737 | New Standard: Test Method of Binocular Image Fusion for Augmented Reality Transparent Displays | |
| | | 7220 | Reapproval of SEMI D59-0519, Terminology for 3D Display | |
| | | TFOF | Transparent Display Task Force | |
| Flexible Hybrid Electronics (FHE) |
| |
|
| Japan |
| |
|
| FHE Terminology |
| |
| | | 6906 | New Standard:Terminology for Flexible Hybrid Electronics (FHE) | |
| | | TFOF | FHE Terminology | |
|
| Tactile texture characteristics for FHE |
| |
| | | 6978 | New Standard: Test Method for The Tactile Texture Characteristics of FHE Materials And Products | |
| | | TFOF | Tactile texture characteristics for FHE | |
|
| North America |
| |
|
| FHE Assembly Task Force |
| |
| | | 7222 | New Standard: Guide for Flexible Hybrid Electronics Assembly | |
| | | TFOF | FHE Assembly Task Force | |
|
| FHE Design Task Force |
| |
| | | 7193 | New Standard: Guide for Substrate and Interconnect Design of Flexible Hybrid Electronics | |
| | | TFOF | FHE Design Task Force | |
|
| FHE Inks Characterization Task Force |
| |
| | | 7212 | New Standard: Guide for Inks Characterization for Flexible Hybrid Electronics | |
| | | TFOF | FHE Inks Characterization Task Force | |
|
| FHE Reliability and Testing Task Force |
| |
| | | TFOF | FHE Reliability and Testing Task Force | |
|
| Taiwan |
| |
|
| FHE System for Wearable Task Force |
| |
| | | 6873 | New Standard: Guide for Salt Mist and Washability Test Flow for Control Module Connector of Electronic textiles | |
| | | 7104 | New Standard: Test Method of Electromyography Sensing Technology of Flexible Hybrid Electronics and Electronic Textiles | |
| | | TFOF | FHE System for Wearable Task Force | |
| FPD - Metrology |
| |
|
| Japan |
| |
|
| FPD Metrology Maintenance Task Force |
| |
| | | TFOF | FPD Metrology Maintenance Task Force | |
|
| Korea |
| |
|
| Automotive Display Task Force |
| |
| | | TFOF | Automotive Display Task Force | |
| Gases |
| |
|
| Europe |
| |
|
| Cleaning Gases |
| |
| | | 6148 | Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing | |
| | | TFOF | Cleaning Gases | |
|
| Permeation Tubes for Trace Moisture Calibration |
| |
| | | TFOF | Permeation Tubes for Trace Moisture Calibration | |
|
| North America |
| |
|
| Filters and Purifiers Task Force |
| |
| | | 7197 | Line-Item Revision to SEMI F28-1103 (Reapproved 0815), Test Method for Measuring Particle Generation from Process Panels | |
| | | 7198 | Line-Item Revision to SEMI F43-0308 (Reapproved 0613), Test Method for Determination of Particle Contribution by Point-of-Use Gas Purifiers and Gas Filters | |
| | | 7199 | Line-Item Revision to SEMI F59-0302 (Reapproved 0613), Test Method for Determination of Filter or Gas System Flow Pressure Drop Curves | |
| | | 7200 | Line-Item Revision to SEMI F67-1101 (Reapproved 0713), Test Method for Determining Inert Gas Purifier Capacity | |
| | | 7201 | Line-Item Revision to SEMI F68-1101 (Reapproved 0713), Test Method for Determining Purifier Efficiency | |
| | | TFOF | Filters and Purifiers Task Force | |
|
| Gases Specification Task Force |
| |
| | | 7097 | Line-Item Revision to SEMI C54-1116, Specification for Oxygen | |
| | | 7237 | Line-Item Revision to SEMI C70-1116, Specification for Tungsten Hexafluoride | |
| | | 7238 | Line-Item Revision to SEMI F113-1116 Test Method for Pressure Transducers Used in Gas Delivery Systems | |
| | | TFOF | Gases Specification Task Force | |
|
| Heater Jacket Task Force |
| |
| | | 6916 | Replacement of SEMI F109-0212, Guide for Heater Systems Requirements,
as a New Standard: Guide for Material Selection for Heaters | |
| | | TFOF | Heater Jacket Task Force | |
|
| Mass Flow Controller Task Force |
| |
| | | 7092 | Line-Item Revision to SEMI E29-1110 (Reapproved 0417), Terminology for the Calibration of Mass Flow Controllers and Mass Flow Meters | |
| | | 7093 | Line-Item Revision to SEMI F62-1016, Test Method for Determining Mass Flow Controller Performance Characteristics for Ambient and Gas Temperature Effects | |
| | | 7151 | Line-Item Revision to SEMI E16-0517, Guide for Determining and Describing Mass Flow Controller Leak Rates | |
| | | 7152 | Line-Item Revision to SEMI E27-1017, Guide for Mass Flow Controller and Mass Flow Meter Linearity | |
| | | 7153 | Line-Item Revision to SEMI E66-0611 (Reapproved 0517), Test Method for Determining Particle Contribution by Mass Flow Controllers | |
| | | TFOF | Mass Flow Controller Task Force | |
|
| Materials of Construction of Gas Delivery Systems Task Force |
| |
| | | 6394 | Line Item Revision to SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems | |
| | | 6612 | New Subordinate Standard: Test Method for the Determination of Conductance of Fluid Handling Components at Subatmoshperic and Vacuum Pressure, to SEMI F32-0211, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves | |
| | | 7202 | Line-Item Revision to SEMI F69-1213E, Test Method for Transport and Shock Testing of Gas Delivery Systems | |
| | | 7203 | Line-Item Revision to SEMI F78-0611 (Reapproved 0917), Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications | |
| | | 7204 | Line-Item Revision to SEMI F81-0611 (Reapproved 0917), Specification for Visual Inspection and Acceptance of Gas Tungsten Arc (GTA) Welds in Fluid Distribution Systems in Semiconductor Manufacturing Applications | |
| | | TFOF | Materials of Construction of Gas Delivery Systems Task Force | |
|
| Pressure Measurement Task Force |
| |
| | | TFOF | Pressure Measurement Task Force | |
|
| Surface Mount Sandwich Component Dimensions Task Force |
| |
| | | TFOF | Surface Mount Sandwich Component Dimensions Task Force | |
| HB-LED |
| |
|
| China |
| |
|
| GaN based LED Epitaxial Wafer Task Force |
| |
| | | TFOF | GaN based LED Epitaxial Wafer Task Force | |
|
| HB-LED Equipment Communication Interface |
| |
| | | TFOF | HB-LED Equipment Communication Interface | |
|
| Patterned Sapphire Substrate Task Force |
| |
| | | 6371 | New Standard: Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate | |
| | | TFOF | Patterned Sapphire Substrate Task Force | |
|
| Sapphire Single Crystal Ingot Task Force |
| |
| | | TFOF | Sapphire Single Crystal Ingot Task Force | |
|
| Sapphire Single Crystal Orientation Task Force |
| |
| | | TFOF | Sapphire Single Crystal Orientation Task Force | |
|
| Single Crystal Sapphire Task Force |
| |
| | | TFOF | Single Crystal Sapphire Task Force | |
|
| North America |
| |
|
| HB-LED Assembly |
| |
| | | TFOF | HB-LED Assembly | |
|
| HB-LED Equipment Automation Interfaces |
| |
| | | TFOF | HB-LED Equipment Automation Interfaces | |
|
| HB-LED Equipment Communication Interfaces TF |
| |
| | | TFOF | HB-LED Equipment Communication Interfaces TF | |
|
| HB-LED Source Materials TF |
| |
| | | 5984 | New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing | |
| | | 5985 | New Standard: Guide for Triethylgallium for HB-LED Manufacturing | |
| | | 5986 | New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing | |
| | | 5987 | New Standard: Guide for Trimethylgallium for HB-LED Manufacturing | |
| | | 5988 | New Standard: Guide for Trimethylindium for HB-LED Manufacturing | |
| | | TFOF | HB-LED Source Materials TF | |
|
| HB-LED Wafer TF |
| |
| | | TFOF | HB-LED Wafer TF | |
|
| Impurities and Defects in HB-LED Sapphire Wafers |
| |
| | | TFOF | Impurities and Defects in HB-LED Sapphire Wafers | |
|
| NA HB-LED Committee |
| |
| | | TFOF | NA HB-LED Committee | |
|
| Patterned Sapphire Substrate (PSS) TF |
| |
| | | TFOF | Patterned Sapphire Substrate (PSS) TF | |
|
| Test Methods TF |
| |
| | | TFOF | Test Methods TF | |
| Information & Control |
| |
|
| China |
| |
|
| Advanced Backend Factory Integration Task Force |
| |
| | | 7018 | Line Item Revision to SEMI E87-0921, Specification For Carrier Management (CMS) and E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS) | |
| | | TFOF | Advanced Backend Factory Integration Task Force | |
|
| GEM300 Task Force |
| |
| | | 7139 | Line Item Revisions to E40-1218, Standard For Processing Management and E40.1-1218, Specification For SECS-II Protocol For Processing Management | |
| | | 7140 | Line Item Revisions to E94-0819R, Specification For Control Job Management and E94.1-0819R, Specification For SECS-II Protocol For Control Job Management (CJM) | |
| | | TFOF | GEM300 Task Force | |
|
| Japan |
| |
|
| Backend Factory Integration Task Force |
| |
| | | TFOF | Backend Factory Integration Task Force | |
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | Diagnostic Data Acquisition Task Force | |
|
| Fab & Equipment Information Security Task Force |
| |
| | | TFOF | Fab & Equipment Information Security Task Force | |
|
| GEM 300 Task Force |
| |
| | | 6920 | Line Item Revision to SEMI E171-0916: SPECIFICATION FOR PREDICTIVE CARRIER LOGISTICS(PCL) and SEMI E171.1-0216: SPECIFICATION FOR SECS-II PROTOCOL FOR PREDICTIVE CARRIER LOGISTICS
| |
| | | 7173 | Line-Item Revision to SEMI E30-0423, SPECIFICATION FOR THE GENERIC MODEL FOR COMMUNICATIONS AND CONTROL OF MANUFACTURING EQUIPMENT (GEM) | |
| | | TFOF | GEM 300 Task Force | |
|
| JA I&C Maintenance Task Force |
| |
| | | 6770 | Line-Item revision to E169-0615 Guide for Equipment Information System Security | |
| | | 6861 | Line Item Revision of E99-0317 Specification for Carrier ID Reader/Writer | |
| | | 6862 | Line Item Revision of E99.1-0317 Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer | |
| | | 7005 | Line Item Revision to SEMI E91-1217: SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL (PSEM) | |
| | | TFOF | JA I&C Maintenance Task Force | |
|
| Sensor Bus Task Force |
| |
| | | TFOF | Sensor Bus Task Force | |
|
| Korea |
| |
|
| Advanced Back-end Factory Integration TF |
| |
| | | TFOF | Advanced Back-end Factory Integration TF | |
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | Diagnostic Data Acquisition Task Force | |
|
| GEM 300 Task Force |
| |
| | | 5832 | New Standard, Specification for Equipment Generic Counter Model (EGCM) | |
| | | TFOF | GEM 300 Task Force | |
|
| North America |
| |
|
| Advanced Backend Factory Integration |
| |
| | | 6852 | Reapproval of SEMI E142.3-1016, Specification for Web Services for Substrate Mapping | |
| | | 6924 | New Standard: Specification for Equipment Management of Consumables and Durables | |
| | | 6925 | New Subordinate Standard: Specification for SECS-II Protocol for Equipment Management of Consumables and Durables | |
| | | 7213 | Line Item Revision to SEMI E142-1022 - Specification for Substrate Mapping, SEMI E142.1-0921E — Specification for XML Schema for Substrate Mapping,
SEMI E142.2-1016 — Specification for SECS II Protocol for Substrate Mapping,
SEMI E142.3-1016 — Specification for Web Services for Substrate Mapping,
SEMI E142.4-1022 — Specification for SECS II Protocol for Substrate Mapping Using Item Transfer | |
| | | 7236 | Line Item Revision to SEMI E90-0921 - Specification for Substrate Tracking and SEMI E90.1-0312 (Reapproved 0921) - Specification for SECS-II Protocol Substrate Tracking | |
| | | TFOF | Advanced Backend Factory Integration | |
|
| Diagnostic Data Acquisition Task Force NA |
| |
| | | 7174 | Line Item Revision to SEMI E128-0414 (Reapproved 0519), Specification for XML Message Structures | |
| | | 7175 | Line Item Revision to SEMI E132-0923 Specification for Equipment Client Authentication and Authorization and SEMI E132.2-0923 Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA) | |
| | | 7176 | Line Item Revision to SEMI E134-0923 Specification for Data Collection Management and SEMI E134.2-0923 Specification for Protocol Buffers of Data Collection Management | |
| | | 7178 | Revision to SEMI E164-0414 (Reapproved 0721), Specification for EDA Common Metadata | |
| | | 7179 | Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Generic Model for Communication and Control of Manufacturing Equipment (GEM) to
SEMI E164-0414 (Reapproved 0721), Specification for EDA Common Metadata | |
| | | 7180 | Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Processing Management to SEMI E164-0414 (Reapproved 0721), Specification for EDA Common Metadata | |
| | | 7181 | Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Carrier Management (CMS) to SEMI E164-0414 (0721), Specification for EDA Common Metadata | |
| | | 7182 | Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Substrate Tracking to SEMI E164-0414 (0721), Specification for EDA Common Metadata | |
| | | 7183 | Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Control Job Management to SEMI E164-0414 (0721), Specification for EDA Common Metadata | |
| | | 7184 | Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Equipment Performance Tracker to SEMI E164-0414 (0721), Specification for EDA Common Metadata | |
| | | 7185 | Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Time Synchronization and Definition of the TS-Clock Object to SEMI E164-0414 (0721), Specification for EDA Common Metadata | |
| | | 7186 | Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Module Process Tracking to SEMI E164-0414 (0721), Specification for EDA Common Metadata | |
| | | 7191 | Line Item Revision to SEMI E179-0623 Specification for Protocol Buffers Common Components | |
| | | 7227 | Line Item Revision to SEMI E125-0923 Specification for Equipment Self Description (EqSD) and SEMI E125.2-0923 Specification for Protocol Buffers for Equipment Self Description (EqSD) | |
| | | 7228 | Line Item Revision to SEMI E134-0923 Specification for Data Collection Management and SEMI E134.2-0923 Specification for Protocol Buffers of Data Collection Management | |
| | | 7229 | Line Item Revision to SEMI 179-0623 Specification for Protocol Buffers Common Components | |
| | | TFOF | Diagnostic Data Acquisition Task Force NA | |
|
| Energy Saving Equipment Communication Task Force |
| |
| | | 6923 | Line Item Revisions to SEMI E167-1213: Specification for Equipment Energy Saving Mode Communications (EESM), SEMI E167.1-1213: Specification for SECS-II Protocol for Equipment Energy Saving Mode Communications, and SEMI E175-1116: Specification for Subsystem Energy Saving Mode Communication (SESMC) | |
| | | 7187 | Revision to SEMI E167-1213 - Specification for Equipment Energy Saving Mode Communications (EESM) and SEMI E167.1-1213 - Specification for SECS-II Protocol for Equipment Energy Saving Mode Communications | |
| | | TFOF | Energy Saving Equipment Communication Task Force | |
|
| Equipment Data Publication (EDP) Task Force |
| |
| | | 7068 | New Standard: Specification for Equipment Data Publication | |
| | | 7069 | Revision to Add a New Subordinate Standard: Specification for Common Data for Etch Components to Specification for Equipment Data Publication | |
| | | 7070 | Revision to Add a New Subordinate Standard: Specification for Common Data for Vacuum Components to Specification for Equipment Data Publication | |
| | | TFOF | Equipment Data Publication (EDP) Task Force | |
|
| Fab & Equipment Computer and Device Security (CDS) Task Force |
| |
| | | 6926 | New Standard: Specification for Equipment Operator Access Management and Monitoring | |
| | | 7230 | New Standard: Specification for Computing Device Cybersecurity Status Reporting | |
| | | 7231 | Revision to Add a New Subordinate Standard: Specification for Protocol Buffers for Computing Device Cybersecurity Status Reporting to Specification for Computing Device Cybersecurity Status Reporting | |
| | | 7232 | Revision to Add a New Subordinate Standard: Specification for SECS-II Protocol for Computing Device Cybersecurity Status Reporting to Specification for Computing Device Cybersecurity Status Reporting | |
| | | TFOF | Fab & Equipment Computer and Device Security (CDS) Task Force | |
|
| GEM 300 Task Force |
| |
| | | 6835 | Line Item Revision to SEMI E87-XXXX, Specification for Carrier Management (CMS) and SEMI E87.1-XXXX, Specification for SECS-II Protocol for Carrier Management (CMS) | |
| | | 6836 | Line Item Revision to SEMI E87-0921, Specification for Carrier Management (CMS) and SEMI E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS) and SEMI E90-0921, Specification for Substrate Tracking and E90.1-0312 (Reapproved 0921), Specification for SECS-II Protocol Substrate Tracking | |
| | | 6992 | Line Item Revision to SEMI E157-0611 (Reapproved 0616), Specification for Module Process Tracking | |
| | | 7064 | Reapproval of SEMI E40-1218, Specification for Processing Management | |
| | | TFOF | GEM 300 Task Force | |
|
| Graphical User Interfaces (GUI) Task Force |
| |
| | | 6743 | Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor
Manufacturing Equipment | |
| | | TFOF | Graphical User Interfaces (GUI) Task Force | |
|
| NA Information and Control Committee |
| |
| | | TFOF | NA Information and Control Committee | |
|
| Process Control System NA |
| |
| | | 6722 | Reapproval of SEMI E54.11 - Specification for Sensor/Actuator Network Specific Device Model for Endpoint Devices | |
| | | 6724 | Reapproval of SEMI E54.3 - Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device | |
| | | 6951 | Reapproval of SEMI E126-0708 - Specification for Equipment Quality Information Parameters (EQIP) | |
| | | 7067 | Line Item Revision to SEMI E133-1218, Specification for Automated Process Control Systems Interface and SEMI E133.1-0318, Specification for XML Messaging for Process Control System (PCS) | |
| | | 7125 | Reapproval of SEMI E133.1-0318 - Specification for XML Messaging for Process Control System (PCS) | |
| | | TFOF | Process Control System NA | |
| | | TFOF | Process Control System NA | |
|
| Sensor Bus Task Force |
| |
| | | 6845 | Reapproval of SEMI E54-0316, Specification for Sensor/Actuator Network | |
| | | 6848 | Reapproval of SEMI E54.20-0316, Specification for Sensor/Actuator Network Communications for EtherCAT | |
| | | 7177 | Line Item Revision to SEMI E54.20-0316 Specification for Sensor/Actuator Network Communications for EtherCAT | |
| | | 7188 | Withdrawal of SEMI E54.15-1107 Sensor/Actuator Network Communication Specification for SafetyBUS p | |
| | | 7189 | Withdrawal of SEMI E54.16-1106 (Reapproved 1211) Specification for Sensor/Actuator Network Communications for Lonworks | |
| | | 7190 | Line Item Revision to SEMI E54.19-1018 Specification for Sensor/Actuator Network for MECHATROLINK | |
| | | 7226 | Line Item Revision to SEMI E54.13-1011 - Specification for Sensor/Actuator Network Communications for Ethernet/IP(TM) | |
| | | TFOF | Sensor Bus Task Force | |
|
| Taiwan |
| |
|
| Backend Factory Integration Task Force |
| |
| | | TFOF | Backend Factory Integration Task Force | |
|
| Equipment Edge Data Governance (EEDG) Task Force |
| |
| | | 6938 | New Standard: Guide for Equipment Edge Data Governance (EEDG) | |
| | | TFOF | Equipment Edge Data Governance (EEDG) Task Force | |
|
| Equipment Information Integration Task Force |
| |
| | | TFOF | Equipment Information Integration Task Force | |
|
| Fab & Equipment Information Security Task Force |
| |
| | | 7103 |
Line Item Revision to SEMI E187(0122)- Specification for Cybersecurity of Fab Equipment
| |
| | | TFOF | Fab & Equipment Information Security Task Force | |
|
| GEM300 Task Force |
| |
| | | TFOF | GEM300 Task Force | |
| Liquid Chemicals |
| |
|
| Europe |
| |
|
| EU Gases and Liquid Chemicals Committee |
| |
| | | TFOF | EU Gases and Liquid Chemicals Committee | |
|
| Precursor Specifications Task Force |
| |
| | | TFOF | Precursor Specifications Task Force | |
|
| Solvents in Advanced Processes |
| |
| | | TFOF | Solvents in Advanced Processes | |
|
| Japan |
| |
|
| Diaphragm Valves Task Force |
| |
| | | TFOF | Diaphragm Valves Task Force | |
|
| Liquid-Borne Particle Counter Task Force |
| |
| | | 6979 | Revision to C77-0912, TEST METHOD FOR DETERMING THE COUNTING EFFICIENY OF LIQUID-BORNE PARTICLE COUNTERS FOR WHICH THE MINIMUM DETECTABLE PARTICLE SIZE IS BETWEEN 30 nm AND 100 nm with title change to TEST METHOD FOR DETERMING THE COUNTING EFFICIENY OF LIQUID-BORNE PARTICLE COUNTERS FOR WHICH THE MINIMUM DETECTABLE PARTICLE SIZE IS BETWEEN 20 nm AND 100 nm | |
| | | TFOF | Liquid-Borne Particle Counter Task Force | |
|
| Liquid Filter Task Force |
| |
| | | 6883 | Reapproval of SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS) | |
| | | 6911 | New Standard, Test Method For Metal Removal Performance Of Liquid Filter | |
| | | TFOF | Liquid Filter Task Force | |
|
| Trace Metal Analysis for High Pure IPA Task Force |
| |
| | | TFOF | Trace Metal Analysis for High Pure IPA Task Force | |
|
| Welding Fitting Task Force |
| |
| | | TFOF | Welding Fitting Task Force | |
|
| North America |
| |
|
| Chemical Analytical Methods Task Force |
| |
| | | 7141 | Revision to SEMI C21-0618, Specification and Guide for Ammonium Hydroxide | |
| | | 7142 | Revision to SEMI C28-0618, Specification and Guide for Hydrofluoric Acid | |
| | | 7143 | Revision to SEMI C29-0618, Specification and Guide for 4.9% Hydrofluoric Acid (10:1 v/v) | |
| | | 7144 | Revision to SEMI C35-0118, Specification and Guide for Nitric Acid | |
| | | 7145 | Revision to SEMI C40-1110 (Reapproved 0618), Specification for Potassium Hydroxide, 45% Solution | |
| | | 7146 | Revision to SEMI C41-0618, Specification and Guide for 2-Propanol | |
| | | 7147 | Revision to SEMI C45-0518, Specification and Guide for Tetraethylorthosilicate (TEOS) | |
| | | 7148 | Revision to SEMI C62-0309 (Reapproved 0618), Specification for Porogen Precursors Used in Low K CVD Processes | |
| | | 7149 | Revision to SEMI C63-1108 (Reapproved 0618), Specification for Organosilicate Precursors Used in Low K CVD Processes | |
| | | TFOF | Chemical Analytical Methods Task Force | |
|
| Chemical Mechanical Planarization Consumables (CMP-C) Task Force |
| |
| | | 6904 | New Standard: Guide for Reporting Performance Parameters of the Retaining Rings for Chemical Mechanical Planarization (CMP) used in Semiconductor Manufacturing | |
| | | 6970 | New Standard: Guide for Reporting Performance Parameters of Pressure Sensitive Adhesives (PSA) for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing | |
| | | TFOF | Chemical Mechanical Planarization Consumables (CMP-C) Task Force | |
|
| High Purity Liquid Assemblies & Systems Task Force |
| |
| | | 6828 | Revision to SEMI F31-0313, Guide for Bulk Chemical Distribution Systems | |
| | | 7214 | Revision of SEMI F41-1116, Guide for Qualification of a Bulk Chemical Distribution System Used in Semiconductor Processing | |
| | | TFOF | High Purity Liquid Assemblies & Systems Task Force | |
|
| High Purity Polymer Materials and Components Task Force |
| |
| | | 6601 | New Standard: Guide to Meet IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water | |
| | | 7006 | Revision to SEMI C69-1015 (Reapproved 1220), Test Method for the Determination of Surface Areas of Polymer Pellets | |
| | | 7089 | Line-Item Revision to SEMI C78-0113 (Reapproved 1218), Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Atomic Force Microscopy | |
| | | 7090 | Line-Item Revision to SEMI C87-0515, Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Contact Profilometry | |
| | | 7091 | Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems, with title change to: Test Method and Specification for Perfluoroalkoxy (PFA) and Other Fluorinated Materials Used in Liquid Chemical Distribution Systems | |
| | | TFOF | High Purity Polymer Materials and Components Task Force | |
|
| Statistical Methods Task Force |
| |
| | | 6451 | Revision to SEMI C1-0310 (Reapproved 0618), Guide for the Analysis of Liquid Chemicals | |
| | | 6509 | Revision to SEMI C64-0308 (Reapproved 1214), SEMI Statistical Guidelines for Ship to Control, with title change | |
| | | 6935 | Revision to SEMI C10-1109 (Reapproved 1114), Guide for Determination of Method Detection Limits | |
| | | TFOF | Statistical Methods Task Force | |
|
| Ultra Pure Water Task Force |
| |
| | | 6716 | Revision to SEMI C79-0819, Guide to Evaluate the Efficacy of Sub-15 nm Filters Used in Ultrapure Water (UPW) Distribution Systems | |
| | | 7086 | Revision to SEMI F61–0521, Guide for Design and Operation of a Semiconductor Ultrapure Water System | |
| | | 7087 | Revision to SEMI F63-0521, Guide for Ultrapure Water Used in Semiconductor Processing | |
| | | 7088 | Revision to SEMI F75-0521, Guide for Quality Monitoring of Ultrapure Water Used in Semiconductor Manufacturing | |
| | | TFOF | Ultra Pure Water Task Force | |
|
| Water Management Task Force |
| |
| | | TFOF | Water Management Task Force | |
| MEMS / NEMS |
| |
|
| International |
| |
|
| Terminology |
| |
| | | TFOF | Terminology | |
|
| North America |
| |
|
| MEMS and Miniaturized Gas Sensing Task Force |
| |
| | | TFOF | MEMS and Miniaturized Gas Sensing Task Force | |
|
| MEMS Material Characterization Task Force |
| |
| | | TFOF | MEMS Material Characterization Task Force | |
|
| MEMS Microfluidics Task Force |
| |
| | | TFOF | MEMS Microfluidics Task Force | |
|
| MEMS Packaging Task Force |
| |
| | | TFOF | MEMS Packaging Task Force | |
|
| MEMS Reliability Task Force |
| |
| | | 7150 | New Standard: Guide to MEMS Manufacturing Readiness Levels | |
| | | TFOF | MEMS Reliability Task Force | |
|
| MEMS Substrate Task Force |
| |
| | | TFOF | MEMS Substrate Task Force | |
|
| NA MEMS/NEMS Committee |
| |
| | | TFOF | NA MEMS/NEMS Committee | |
|
| Wafer Bond Task Force |
| |
| | | TFOF | Wafer Bond Task Force | |
| Metrics |
| |
|
| Japan |
| |
|
| Cycle Time Metrics Task Force |
| |
| | | TFOF | Cycle Time Metrics Task Force | |
|
| Japan RF Measurement liaison Task Force |
| |
| | | 6550 | Revision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | TFOF | Japan RF Measurement liaison Task Force | |
|
| North America |
| |
|
| Critical Chamber Components (CCC) Test Methods Task Force |
| |
| | | 6931 | New Standard: Test Method for Measuring Organics Contamination Through Thermal Desorption or Solvent Extraction Gas Chromatography Mass Spectrometry of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection | |
| | | 7129 | New Standard: Test Method for Liquid Particle Counter Measuring Particles Contamination of Critical Chamber Components and Coupons | |
| | | 7130 | New Standard: Test Method for Measuring Surface Contamination by Particle Concentration Through Replacement Substrate and Optical Metrology of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection | |
| | | 7167 | New Standard: Test Method for Measuring and Characterizing Surface Particle Contamination on Critical Chamber Components with Airborne Particle Counter and Dry Aerosolizing Chamber | |
| | | TFOF | Critical Chamber Components (CCC) Test Methods Task Force | |
|
| EMC Task Force |
| |
| | | 6894 | Line Item Revision to E33-0217E, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) and E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment | |
| | | TFOF | EMC Task Force | |
|
| Equipment Cost of Ownership Task Force |
| |
| | | TFOF | Equipment Cost of Ownership Task Force | |
|
| Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force |
| |
| | | TFOF | Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force | |
|
| Equipment Training and Documentation Task Force |
| |
| | | TFOF | Equipment Training and Documentation Task Force | |
|
| ESD/ESC Task Force- N.A |
| |
| | | 6971 | Revision to SEMI E163-0212, Guide for the Handling of Reticles and Other Extremely Electrostatic Sensitive (EES) Items Within Specially Designated Areas | |
| | | TFOF | ESD/ESC Task Force- N.A | |
|
| North America Metrics Technical Committee |
| |
| | | 7235 | Reapproval of SEMI E43-0813 (Reapproved 1019), Guide for Electrostatic Measurements on Objects and Surfaces | |
| | | TFOF | North America Metrics Technical Committee | |
|
| RF Measurements Task Force |
| |
| | | TFOF | RF Measurements Task Force | |
| Micropatterning |
| |
|
| North America |
| |
|
| Curvilinear Format Task Force |
| |
| | | TFOF | Curvilinear Format Task Force | |
|
| Mask Orders Task Force |
| |
| | | TFOF | Mask Orders Task Force | |
|
| Micropatterning Committee |
| |
| | | 7026 | Reapproval of SEMI P44-1216 Specification for Open Artwork System Interchange Standard (OASIS ®) Specific to Mask Tools
| |
| | | 7027 | Reapproval of SEMI P39-0416 Specification for OASIS® – Open Artwork System Interchange Standard
| |
|
| NA Microlithography Committee for 5-Year Review |
| |
| | | TFOF | NA Microlithography Committee for 5-Year Review | |
|
| P39 Revision Task Force |
| |
| | | 7239 | Revision of SEMI P39-0416, Specification for OASIS – Open Artwork System Interchange Standard | |
| | | TFOF | P39 Revision Task Force | |
|
| P47 Revision Task Force |
| |
| | | 6516 |
Revision to SEMI P47 Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
| |
| | | TFOF | P47 Revision Task Force | |
|
| Patterning Metrology Task Force |
| |
| | | TFOF | Patterning Metrology Task Force | |
| Photovoltaic |
| |
|
| China |
| |
|
| Building Integrated Photovoltaic (BIPV) Task Force |
| |
| | | TFOF | Building Integrated Photovoltaic (BIPV) Task Force | |
|
| Crystalline Silicon Solar Cell Task Force |
| |
| | | 7166 | Revision to SEMI PV79-0818, Test Method for Exposure Durability of Photovoltaic (PV) Cells to Acetic Acid Vapor | |
| | | TFOF | Crystalline Silicon Solar Cell Task Force | |
|
| Perovskite Thin Film PV Materials and Modules Task Force |
| |
| | | 7164 | New Standard: Specification of Terrestrial Perovskite Photovoltaic (PV) Module Sizes | |
| | | 7165 | New Standard: Specification of FAI for Perovskite Photovoltaic (PV) Industry | |
| | | TFOF | Perovskite Thin Film PV Materials and Modules Task Force | |
|
| PV Equipment Task Force |
| |
| | | 7054 | Reapproval of SEMI PV81-0318, Guide for Specifying Low Pressure Horizontal Diffusion Furnace | |
| | | 7055 | New Standard: Guide for Tube PECVD Graphite Boat Materials for Solar Cell Production | |
| | | TFOF | PV Equipment Task Force | |
|
| PV Module Task Force |
| |
| | | TFOF | PV Module Task Force | |
|
| Thin Film PV Module Task Force |
| |
| | | TFOF | Thin Film PV Module Task Force | |
|
| Taiwan |
| |
|
| Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force |
| |
| | | 6297 | New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC) | |
| | | 6539 | New Standard :Specification of reference device for indoor lighting simulator | |
| | | 6540 | New Standard :Test Method for Durability of Flexible emerging PV | |
| | | TFOF | Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force | |
|
| PV Reliability Test Method Task Force |
| |
| | | 6705 | Reapproval of PV72-0316 Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation | |
| | | 7207 | Reapproval of SEMI PV23-1011 (Reapproved 0818), Test Method for Mechanical Vibration of Crystalline Silicon Photovoltaic (PV) Modules in Shipping Environment | |
| | | 7208 | Reapproval of SEMI PV38-0912 (Reapproved 0818), Test Method for Mechanical Vibration of c-Si PV Cells in Shipping Environment | |
| | | 7209 | Reapproval of SEMI PV72-0316, Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation | |
| | | 7210 | Reapproval of SEMI PV84-0818, Test Method for Polymer Foil Dependent Discoloration of Silver Fingers on Photovoltaic Modules | |
| | | TFOF | PV Reliability Test Method Task Force | |
| Photovoltaic (PV) - Materials |
| |
|
| China |
| |
|
| PV Silicon Raw Materials Task Force |
| |
| | | TFOF | PV Silicon Raw Materials Task Force | |
|
| PV Silicon Wafer Task Force |
| |
| | | 6922 | New Standard: Classification of Reusable Silicon Material | |
| | | TFOF | PV Silicon Wafer Task Force | |
|
| Europe |
| |
|
| PV Material Degradation Task Force |
| |
| | | TFOF | PV Material Degradation Task Force | |
|
| PV Silicon Materials Task Force |
| |
| | | TFOF | PV Silicon Materials Task Force | |
|
| Japan |
| |
|
| Japan PV Materials Task Force |
| |
| | | TFOF | Japan PV Materials Task Force | |
|
| North America |
| |
|
| International PV Analytical Test Methods, Metrology, and Inspection Task Force |
| |
| | | TFOF | International PV Analytical Test Methods, Metrology, and Inspection Task Force | |
| Physical Interfaces & Carriers |
| |
|
| International |
| |
|
| Global PIC Maintenance Task Force |
| |
| | | 6833 | Reapproval of SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface | |
| | | 6834 | Reapproval of SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight | |
| | | 7000 | Line Item Revision to SEMI E84-1109, Specification for Enhanced Carrier Handoff Parallel I/O Interface | |
| | | TFOF | Global PIC Maintenance Task Force | |
|
| Japan |
| |
|
| Global PIC Maintenance Task Force |
| |
| | | 7170 | Line-Item Revision to SEMI E184 -1221E Specification for 300 mm Tape Frame FOUP Load Port | |
| | | 7171 | Line-Item Revision to SEMI E185 -1222 Specification for 300 mm Tape Frame FOUP | |
|
| Japan Electron Microscopy Workflow liaison Task Force |
| |
| | | TFOF | Japan Electron Microscopy Workflow liaison Task Force | |
|
| Next Gen Assembly / Test Material Handling Task Force |
| |
| | | 7172 | New Standard: Specification for Next Gen Assembly / Test Carrier | |
| | | TFOF | Next Gen Assembly / Test Material Handling Task Force | |
|
| Panel Level Packaging Panel FOUP Task Force |
| |
| | | 7112 |
Line Item Revision to SEMI E181-0423 - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING, SEMI E181.1-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 12 SLOTS,
SEMI E181.2-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 6 SLOTS,
SEMI E181.3-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS, and
SEMI E181.4-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS
| |
| | | 7113 |
Line Item Revision to SEMI E182-0621 - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING, | |
| | | TFOF | Panel Level Packaging Panel FOUP Task Force | |
|
| North America |
| |
|
| Electron Microscopy Workflow Task Force |
| |
| | | 6592 | New Standard: Specification for Container for Transport and Storage of Transmission Electron Microscope (TEM) Lamella Carriers within Electron Microscopy Workflows | |
| | | 6832 | New Standard: Specification for Shipping Container for Transport of Transmission Electron Microscope (TEM) Lamella Carriers (LC) from LC-supplier to LC-end user | |
| | | TFOF | Electron Microscopy Workflow Task Force | |
|
| Film Frame FOUP (FFF) Task Force |
| |
| | | 6896 | New Standard: Specification for 300 mm Frame Carrier FOUP | |
| | | 7194 | New Standard: Specification for 300 mm Film Frame FOUP Load Port | |
| | | TFOF | Film Frame FOUP (FFF) Task Force | |
|
| Global PIC Maintenance Task Force |
| |
| | | 6918 | Line-Item Revision to SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface | |
|
| Integrated Workflows in Failure Analysis Task Force |
| |
| | | TFOF | Integrated Workflows in Failure Analysis Task Force | |
|
| SEMI E72 Revision Task Force |
| |
| | | 7195 | Revision to SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight | |
| | | TFOF | SEMI E72 Revision Task Force | |
| Silicon Wafer |
| |
|
| Europe |
| |
|
| International Advanced Wafer Geometry Task Force |
| |
| | | 7163 | Reapproval of SEMI MF1530-0707 (Reapproved 1018): Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning | |
| | | 7192 | Revision of SEMI M73-1013E (Reapproved 1019) Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles | |
|
| International Polished Wafers Task Force |
| |
| | | 7024 | Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
| |
|
| International Test Methods Task Force |
| |
| | | 7162 | New Standard: Test Method for epi-resistivity determination in Si wafers by Surface Charge Profiling | |
|
| International |
| |
|
| International 450 mm Shipping Box |
| |
| | | TFOF | International 450 mm Shipping Box | |
|
| International Advanced Wafer Geometry Task Force |
| |
| | | TFOF | International Advanced Wafer Geometry Task Force | |
|
| International Annealed Si Wafer Task Force |
| |
| | | TFOF | International Annealed Si Wafer Task Force | |
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | TFOF | International Automated Advanced Surface Inspection Task Force | |
|
| International Epitaxial Wafers Task Force |
| |
| | | TFOF | International Epitaxial Wafers Task Force | |
|
| International Polished Wafers Task Force |
| |
| | | TFOF | International Polished Wafers Task Force | |
|
| International SOI Wafers Task Force |
| |
| | | TFOF | International SOI Wafers Task Force | |
|
| International Terminology Task Force |
| |
| | | TFOF | International Terminology Task Force | |
|
| International Test Methods Task Force |
| |
| | | TFOF | International Test Methods Task Force | |
|
| Japan |
| |
|
| International Advanced Wafer Geometry Task Force |
| |
| | | 6983 | Revision for M49 “GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 nm TO 16 nm TECHNOLOGY GENERATIONS" | |
|
| International Test Methods Task Force |
| |
| | | 6570 | New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scattering Tomography Technique | |
| | | 6687 | Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity | |
|
| JA Shipping Box Task Force |
| |
| | | TFOF | JA Shipping Box Task Force | |
|
| Japan AWG Task Force |
| |
| | | TFOF | Japan AWG Task Force | |
|
| Japan TC Chapter of Global Technical Tommittee |
| |
| | | TFOF | Japan TC Chapter of Global Technical Tommittee | |
|
| Japan Test Method Task Force |
| |
| | | 5772 | Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage | |
| | | 6702 | Revision of M60: TEST METHOD FOR TIME DEPENDENT DIELECTRIC BREAKDOWN CHARACTERISTICS OF Amorphous SiO2 FILMS FOR Silicon WAFER EVALUATION | |
| | | TFOF | Japan Test Method Task Force | |
|
| Test Method Task Force |
| |
| | | TFOF | Test Method Task Force | |
|
| North America |
| |
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | 7223 | Reapproval of SEMI M35-1114 (Reapproved 1019) Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection | |
|
| International SOI Wafers Task Force |
| |
| | | 6583 | New Standard: Specification for SOI Wafers for RF Device Applications | |
|
| International Test Methods Task Force |
| |
| | | 7224 | Reapproval of SEMI MF1528-0413 (Reapproved 1018) Test Method for Measuring Boron Contamination in Heavily Doped N-Type Silicon Substrates by Secondary Ion Mass Spectrometry | |
|
| Silicon Wafer Committee |
| |
| | | TFOF | Silicon Wafer Committee | |
| Traceability |
| |
|
| Japan |
| |
|
| 5 Year Review TF |
| |
| | | 7137 | Reapproval of SEMI T15-0818, Specification for Jig ID: Concept
| |
| | | 7138 | Reapproval of SEMI T22-0212 (Reapproved 0618), Specification for Traceability by Self Authentication Service Body and Authentication Service Body | |
| | | TFOF | 5 Year Review TF | |
|
| Blockchain Task Force |
| |
| | | 6910 | New Standard: Specification of Blockchain for Semiconductor supply chain Traceability | |
| | | TFOF | Blockchain Task Force | |
|
| Japan Equipment & Materials Traceability liaison Task Force |
| |
| | | TFOF | Japan Equipment & Materials Traceability liaison Task Force | |
|
| Japan Single Device Traceability liaison Task Force |
| |
| | | TFOF | Japan Single Device Traceability liaison Task Force | |
|
| Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force |
| |
| | | TFOF | Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force | |
|
| North America |
| |
|
| 5 Year Review Task Force |
| |
| | | 7136 | Reapproval of SEMI T3-1213 (Reapproved 0419), Specification for Wafer Box Labels | |
| | | TFOF | 5 Year Review Task Force | |
|
| Equipment and Materials Traceability Task Force |
| |
| | | 6449 | New Standard: Specification for Equipment and Materials Part Traceability | |
| | | TFOF | Equipment and Materials Traceability Task Force | |
|
| License Server Certification |
| |
| | | TFOF | License Server Certification | |
|
| Single Device Traceability Task Force |
| |
| | | 6504 | New Standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain | |
| | | 7234 | New Standard: Specification for Electronic Supply Chain Traceability Using Distributed Ledger Technology | |
| | | TFOF | Single Device Traceability Task Force | |